DRAM Chip SDR SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Tray
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.32.00.24 |
DRAM Type | SDR SDRAM |
Chip Density (bit) | 256M |
Organization | 16Mx16 |
Number of Internal Banks | 4 |
Number of Words per Bank | 4M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 167 |
Maximum Access Time (ns) | 17|7.5|5.4 |
Address Bus Width (bit) | 15 |
Process Technology | CMOS |
接口类型 Interface Type | LVTTL |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Operating Current (mA) | 100 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 16 |
系列 Packaging | Tray |
Supplier Package | TSOP-II |
Pin Count | 54 |
Standard Package Name | SOP |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Length | 22.22 |
Package Width | 10.16 |
PCB changed | 54 |
Lead Shape | Gull-wing |
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