Digital Isolator Logic 6-CH 10MHZ 32-Pin BGA Tray
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.39.00.01 |
类型 Type | I2C|SPI |
Number of Channels per Chip | 6 |
Maximum Data Rate | 10MHZ |
Maximum Rise Time (ns) | 35 |
Maximum Fall Time (ns) | 35 |
输出类型 Output Type | Logic |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4.5 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Propagation Delay Time (tPHL) (ns) | 100 |
Maximum Propagation Delay Time (tPLH) (ns) | 100 |
Maximum Working Insulation Voltage | 560Vp |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
系列 Packaging | Tray |
Forward/Reverse Channels | 3/3 |
Minimum Common Mode Rejection (kV/us) | 30 |
Supplier Temperature Grade | Commercial |
Coupling Type | Capacitive Coupling |
Standard Package Name | BGA |
Supplier Package | BGA |
Pin Count | 32 |
Mounting | Surface Mount |
Package Height | 2.82 |
Package Length | 15 |
Package Width | 11.25 |
PCB changed | 32 |
Lead Shape | Ball |
LTM2887CY-5S#PBF | LTM2887CY-3I#PBF | LTM2887CY-3S#PBF | LTM2887CY-5I#PBF | |
---|---|---|---|---|
描述 | Digital Isolator Logic 6-CH 10MHZ 32-Pin BGA Tray | Digital Isolator Logic 6-CH 10MHZ 32-Pin BGA Tray | Digital Isolator Logic 6-CH 10MHZ 32-Pin BGA Tray | Digital Isolator Logic 6-CH 10MHZ 32-Pin BGA Tray |
欧盟限制某些有害物质的使用 | Compliant | Compliant | Compliant | Compliant |
ECCN (US) | EAR99 | EAR99 | EAR99 | EAR99 |
Part Status | Active | Active | Active | Active |
HTS | 8542.39.00.01 | 8542.39.00.01 | 8542.39.00.01 | 8542.39.00.01 |
类型 Type |
I2C|SPI | I2C|SPI | SPI|I2C | SPI|I2C |
Number of Channels per Chip | 6 | 6 | 6 | 6 |
Maximum Data Rate | 10MHZ | 10MHZ | 10MHZ | 10MHZ |
Maximum Rise Time (ns) | 35 | 12.5 | 35 | 35 |
Maximum Fall Time (ns) | 35 | 35 | 35 | 35 |
输出类型 Output Type |
Logic | Logic | Logic | Logic |
Maximum Operating Supply Voltage (V) | 5.5 | 5.5 | 3.6 | 5.5 |
Minimum Operating Supply Voltage (V) | 4.5 | 4.5 | 3 | 4.5 |
Minimum Isolation Voltage (Vrms) | 2500 | 2500 | 2500 | 2500 |
Maximum Propagation Delay Time (tPHL) (ns) | 100 | 100 | 100 | 100 |
Maximum Propagation Delay Time (tPLH) (ns) | 100 | 100 | 100 | 100 |
Maximum Working Insulation Voltage | 560Vp | 560Vp | 560Vp | 560Vp |
Maximum Operating Temperature (°C) | 70 | 70 | 70 | 70 |
系列 Packaging |
Tray | Tray | Tray | Tray |
Forward/Reverse Channels | 3/3 | 3/3 | 3/3 | 3/3 |
Minimum Common Mode Rejection (kV/us) | 30 | 30 | 30 | 30 |
Coupling Type | Capacitive Coupling | Capacitive Coupling | Capacitive Coupling | Capacitive Coupling |
Standard Package Name | BGA | BGA | BGA | BGA |
Supplier Package | BGA | BGA | BGA | BGA |
Pin Count | 32 | 32 | 32 | 32 |
Mounting | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Package Height | 2.82 | 2.82 | 2.82 | 2.82 |
Package Length | 15 | 15 | 15 | 15 |
Package Width | 11.25 | 11.25 | 11.25 | 11.25 |
PCB changed | 32 | 32 | 32 | 32 |
Lead Shape | Ball | Ball | Ball | Ball |
Supplier Temperature Grade | Commercial | - | Commercial | Commercial |
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