Driver 2-OUT High Side Inv 8-Pin SOIC N T/R
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | SOP, |
| 针数 | 8 |
| 制造商包装代码 | 05-08-1610 (S8) |
| Reach Compliance Code | compliant |
| 高边驱动器 | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9025 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.752 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.899 mm |
| LTC1623CS8#TRPBF | LTC1623CMS8#PBF | LTC1623CMS8#TRPBF | LTC1623CS8#PBF | LTC1623IS8#PBF | LTC1623IS8#TRPBF | |
|---|---|---|---|---|---|---|
| 描述 | Driver 2-OUT High Side Inv 8-Pin SOIC N T/R | Driver 2-OUT High Side Inv 8-Pin MSOP Tube | Driver 2-OUT High Side Inv 8-Pin MSOP T/R | Driver 2-OUT High Side Inv 8-Pin SOIC N Tube | Driver 2-OUT High Side Inv 8-Pin SOIC N Tube | Driver 2-OUT High Side Inv 8-Pin SOIC N T/R |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | SOP, | TSSOP, | TSSOP, | SOP, | SOP, | SOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | 05-08-1610 (S8) | 05-08-1660 | 05-08-1660 | 05-08-1610 (S8) | 05-08-1610 (S8) | 05-08-1610 (S8) |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 高边驱动器 | YES | YES | YES | YES | YES | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.9025 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 4.9025 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 250 | 260 | 260 | 250 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.752 mm | 1.17 mm | 1.17 mm | 1.75 mm | 1.75 mm | 1.752 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | MATTE TIN | MATTE TIN | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED |
| 宽度 | 3.899 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3.899 mm |
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