Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N T/R
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Not Compliant |
ECCN (US) | EAR99 |
Part Status | Unconfirmed |
SVHC | Yes |
SVHC Exceeds Threshold | Yes |
类型 Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 2 |
Process Technology | BiCOM |
Maximum Input Offset Voltage (mV) | 1@±5V |
Minimum Dual Supply Voltage (V) | ±2.5 |
Typical Dual Supply Voltage (V) | ±3|±5|±9|±12|±15 |
Maximum Dual Supply Voltage (V) | ±18 |
Maximum Input Offset Current (uA) | 0.25@±15V |
Maximum Input Bias Current (uA) | 1@±15V |
Maximum Supply Current (mA) | 9.6@±5V |
Typical Output Current (mA) | 29@±5V |
Power Supply Type | Dual |
Typical Slew Rate (V/us) | 350@±5V |
Typical Input Noise Voltage Density (nV/rtHz) | 9@±15V |
Typical Voltage Gain (dB) | 76.12 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.9@±15V |
Minimum PSRR (dB) | 93 |
Minimum CMRR (dB) | 79 |
Minimum CMRR Range (dB) | 75 to 80 |
Typical Gain Bandwidth Product (MHz) | 37 |
Typical Settling Time (ns) | 65 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
系列 Packaging | Tape and Reel |
Pin Count | 8 |
Standard Package Name | SOP |
Supplier Package | SOIC N |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Package Width | 3.99(Max) |
PCB changed | 8 |
Lead Shape | Gull-wing |
LT1361CS8#TR | LT1361CN8 | LT1361CS8#PBF | LT1361CS8#TRPBF | LT1361CS8 | |
---|---|---|---|---|---|
描述 | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N T/R | Op Amp Dual High Speed Amplifier ±18V 8-Pin PDIP N | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N Tube | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N T/R | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N |
欧盟限制某些有害物质的使用 | Not Compliant | Not Compliant | Compliant | Compliant | Not Compliant |
ECCN (US) | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Part Status | Unconfirmed | Unconfirmed | Active | Active | Unconfirmed |
类型 Type |
High Speed Amplifier | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier |
Number of Channels per Chip | 2 | 2 | 2 | 2 | 2 |
Process Technology | BiCOM | BiCOM | BiCOM | BiCOM | BiCOM |
Maximum Input Offset Voltage (mV) | 1@±5V | 1@±5V | 1@±5V | 1@±5V | 1@±5V |
Minimum Dual Supply Voltage (V) | ±2.5 | ±2.5 | ±2.5 | ±2.5 | ±2.5 |
Typical Dual Supply Voltage (V) | ±3|±5|±9|±12|±15 | ±9|±5|±3|±15|±12 | ±3|±5|±9|±12|±15 | ±3|±15|±5|±9|±12 | ±15|±3|±5|±9|±12 |
Maximum Dual Supply Voltage (V) | ±18 | ±18 | ±18 | ±18 | ±18 |
Maximum Input Offset Current (uA) | 0.25@±15V | 0.25@±15V | 0.25@±15V | 0.25@±15V | 0.25@±15V |
Maximum Input Bias Current (uA) | 1@±15V | 1@±15V | 1@±15V | 1@±15V | 1@±15V |
Maximum Supply Current (mA) | 9.6@±5V | 9.6@±5V | 9.6@±5V | 9.6@±5V | 9.6@±5V |
Typical Output Current (mA) | 29@±5V | 29@±5V | 29@±5V | 29@±5V | 29@±5V |
Power Supply Type | Dual | Dual | Dual | Dual | Dual |
Typical Slew Rate (V/us) | 350@±5V | 350@±5V | 350@±5V | 350@±5V | 350@±5V |
Typical Input Noise Voltage Density (nV/rtHz) | 9@±15V | 9@±15V | 9@±15V | 9@±15V | 9@±15V |
Typical Voltage Gain (dB) | 76.12 | 76.12 | 76.12 | 76.12 | 76.12 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.9@±15V | 0.9@±15V | 0.9@±15V | 0.9@±15V | 0.9@±15V |
Minimum PSRR (dB) | 93 | 93 | 93 | 93 | 93 |
Minimum CMRR (dB) | 79 | 79 | 79 | 79 | 79 |
Minimum CMRR Range (dB) | 75 to 80 | 75 to 80 | 75 to 80 | 75 to 80 | 75 to 80 |
Typical Gain Bandwidth Product (MHz) | 37 | 37 | 37 | 37 | 37 |
Typical Settling Time (ns) | 65 | 65 | 65 | 65 | 65 |
Shut Down Support | No | No | No | No | No |
Maximum Operating Temperature (°C) | 70 | 70 | 70 | 70 | 70 |
Supplier Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial |
Pin Count | 8 | 8 | 8 | 8 | 8 |
Standard Package Name | SOP | DIP | SOP | SOP | SOP |
Supplier Package | SOIC N | PDIP N | SOIC N | SOIC N | SOIC N |
Mounting | Surface Mount | Through Hole | Surface Mount | Surface Mount | Surface Mount |
Package Height | 1.5(Max) | 3.3 | 1.5(Max) | 1.5(Max) | 1.5(Max) |
Package Length | 5(Max) | 10.16(Max) | 5(Max) | 5(Max) | 5(Max) |
Package Width | 3.99(Max) | 6.48 | 3.99(Max) | 3.99(Max) | 3.99(Max) |
PCB changed | 8 | 8 | 8 | 8 | 8 |
Lead Shape | Gull-wing | Through Hole | Gull-wing | Gull-wing | Gull-wing |
SVHC | Yes | Yes | - | - | Yes |
SVHC Exceeds Threshold | Yes | Yes | - | - | Yes |
系列 Packaging |
Tape and Reel | - | Tube | Tape and Reel | - |
HTS | - | 8542.33.00.01 | 8542.33.00.01 | - | 8542.33.00.01 |
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