CMG07
TOSHIBA Rectifier Silicon Diffused Type
CMG07
○
General-Purpose Rectifiers
Unit: mm
•
•
•
•
Repetitive peak reverse voltage : V
RRM
= 400 V
Average forward current
Peak forward voltage
: V
FM
=1.1 V (max) @I
F
= 1 A
: I
F (AV)
= 1 A
Suitable for high-density board assembly due to the use of a small
Toshiba Nickname: M−FLAT
TM
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak forward surge current
Junction temperature
Storage temperature
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
400
1 (Note1)
30 (50 Hz)
150
-40 to 150
Unit
V
A
A
°C
°C
JEDEC
JEITA
TOSHIBA
―
―
3-4E1S
Note1:
Ta=78°C Device mounted on a ceramic board
Board size
: 50 mm
×
50 mm
Soldering land size
: 2 mm
×
2 mm
Board thickness
: 0.64 mm
Rectangular waveform :
α =
180°
Weight: 0.023 g (typ.)
Note 2:
Using continuously under heavy loads (e.g. the application
of high temperature/current/voltage and the significant change in temperature, etc.) may cause this
product to decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
V
FM (1)
Peak forward voltage
V
FM (2)
V
FM (3)
Peak repetitive reverse current
I
RRM
Test Condition
I
FM
= 0.1 A (pulse test)
I
FM
= 0.7 A (pulse test)
I
FM
= 1 A (pulse test)
V
RRM
= 400 V (pulse test)
Device mounted on a ceramic board
board size
50 mm
×
50 mm
soldering land size
2 mm
×
2 mm
board thickness
0.64 mm
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
board size
50 mm
×
50 mm
soldering land size
6 mm
×
6 mm
board thickness
1.6 mm
Device mounted on a glass-epoxy board
board size
50 mm
×
50 mm
soldering land size
2.1 mm
×
1.4 mm
board thickness
1.6 mm
Thermal resistance (junction to lead)
R
th (j-ℓ)
―
Min
―
―
―
―
―
Typ.
0.80
0.91
0.94
―
―
Max
―
―
1.1
10
μA
V
Unit
60
―
―
125
°C/W
―
―
―
―
200
16
°C/W
Start of commercial production
2008-10
1
2018-07-06
CMG07
Marking
Abbreviation Code
G7
Part No.
CMG07
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
Handling Precaution
1)
The absolute maximum ratings are rated values that must not be exceeded during operation, even for
aninstant. The following are the recommended general derating methods for designing a circuit board
usingthis device.
V
RRM
: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the
absolute maximum rating of V
RRM
for a DC circuit and be no greater than 50% of that of V
RRM
for an
AC circuit. V
RRM
has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into
account designing a device at low temperature.
I
F (AV)
:We recommend that the worst case current be no greater than 80% of the absolute maximum rating of
I
F (AV)
and T
j
be below 120°C. When using this device, take the margin into consideration by using an
allowable Ta max-I
F (AV)
curve.
I
FSM
:This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal
operation, which seldom occurs during the lifespan of a device.
T
j
:Derate device parameters in proportion to this rating in order to ensure high reliability. We recommend
that the junction temperature (Tj) of a device be kept below 120°C.
2)
Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit
board. An appropriate thermal resistance value should be used, considering the circuit board design and
land pattern dimensions (provided for reference only).
For other design considerations, see the Toshiba website.
3)
2.1
2
2018-07-06
CMG07
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields.
IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
For details, please contact your
TOSHIBA sales representative.
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
•
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
•
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive.
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
4
2018-07-06
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
