8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM
P89LPC932A1 | P89LPC932A1FDH/G,5 | P89LPC932A1FA | P89LPC932A1FDH | P89LPC932A1FHN | P89LPC932A1FN | |
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描述 | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM | 8-BIT, FLASH, 12 MHz, MICROCONTROLLER, PDSO28 | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM |
厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
零件包装代码 | - | TSSOP2 | LCC | TSSOP | QFN | DIP |
包装说明 | - | 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28 | PLASTIC, MS-018, SOT-261-2, LCC-28 | TSSOP, TSSOP28,.25 | HVQCCN, LCC28,.24SQ,25 | DIP, DIP28,.6 |
针数 | - | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | - | unknown | unknown | compliant | compliant | unknow |
具有ADC | - | - | NO | NO | NO | NO |
位大小 | - | - | 8 | 8 | 8 | 8 |
CPU系列 | - | - | 8051 | 8051 | 8051 | 8051 |
最大时钟频率 | - | - | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
DAC 通道 | - | - | NO | NO | NO | NO |
DMA 通道 | - | - | NO | NO | NO | NO |
JESD-30 代码 | - | - | S-PQCC-J28 | R-PDSO-G28 | S-PQCC-N28 | R-PDIP-T28 |
JESD-609代码 | - | - | e3 | e4 | e4 | e3/e4 |
长度 | - | - | 11.505 mm | 9.7 mm | 6 mm | 35.5 mm |
I/O 线路数量 | - | - | 26 | 26 | 26 | 26 |
端子数量 | - | - | 28 | 28 | 28 | 28 |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | - | - | YES | YES | YES | YES |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | QCCJ | TSSOP | HVQCCN | DIP |
封装等效代码 | - | - | LDCC28,.5SQ | TSSOP28,.25 | LCC28,.24SQ,25 | DIP28,.6 |
封装形状 | - | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | - | - | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE |
电源 | - | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | - | - | 768 | 768 | 768 | 768 |
ROM(单词) | - | - | 8192 | 8192 | 8192 | 8192 |
ROM可编程性 | - | - | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | - | - | 4.57 mm | 1.1 mm | 1 mm | 5.1 mm |
速度 | - | - | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | - | - | 18 mA | 18 mA | 18 mA | 23 mA |
最大供电电压 | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | - | - | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
标称供电电压 | - | - | 3 V | 3 V | 3 V | 3 V |
表面贴装 | - | - | YES | YES | YES | NO |
技术 | - | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | - | TIN | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | TIN/NICKEL PALLADIUM GOLD |
端子形式 | - | - | J BEND | GULL WING | NO LEAD | THROUGH-HOLE |
端子节距 | - | - | 1.27 mm | 0.65 mm | 0.65 mm | 2.54 mm |
端子位置 | - | - | QUAD | DUAL | QUAD | DUAL |
宽度 | - | - | 11.505 mm | 4.4 mm | 6 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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