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SMCJ5638E3

产品描述Trans Voltage Suppressor Diode, 1500W, 12.9V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小170KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

SMCJ5638E3概述

Trans Voltage Suppressor Diode, 1500W, 12.9V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2

SMCJ5638E3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-214AB
包装说明ROHS COMPLIANT, PLASTIC PACKAGE-2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性HIGH RELIABILITY
最大击穿电压17.6 V
最小击穿电压14.4 V
击穿电压标称值16 V
最大钳位电压23.5 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-214AB
JESD-30 代码R-PDSO-C2
JESD-609代码e3
湿度敏感等级1
最大非重复峰值反向功率耗散1500 W
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散5 W
认证状态Not Qualified
最大重复峰值反向电压12.9 V
表面贴装YES
技术AVALANCHE
端子面层MATTE TIN
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

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SMCG5629 thru SMCG5665A, e3
and SMCJ5629 thru SMCJ5665A, e3
TRANSIENT VOLTAGE SUPPRESSORS
SCOTTSDALE DIVISION
DESCRIPTION
These surface mount Transient Voltage Suppressors (TVSs) are used for protecting
sensitive components requiring low clamping voltage levels. They are rated at high
current impulses typically generated by inductive switching transients. They are also
optionally available as RoHS Compliant (annealed matte-Tin finish) with an e3 suffix
added to the part number. Other benefits are achieved with low-profile surface mount
J-bend or Gull-wing terminals for stress-relief and lower weight. Its low-flat profile
provides easier insertion or automatic handling benefits compared to other MELF style
packages. Options for screening to avionics grade with MA prefix or similar to JAN,
JANTX, JANTXV, and JANS by using MQ, MX, MV or MSP respectively for part
number prefixes for screening in accordance with MIL-PRF-19500/500.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Reliability data per JESD22-A108, JESD22-A104
JESD22-A113-B, JESD22-A101-B, and JESD22-A102
Thermally efficient surface mount with J-bends or Gull
wings termination for stress relief (flat handling surface
and easier placement)
Optional 100% screening for avionics grade available by
adding MA prefix to part number for added 100%
temperature cycle -55°C to +125°C (10X), surge (3X), 24
hours HTRB and post test (V
BR
and I
D
)
Options for screening in accordance with MIL-PRF-
19500/500 for JAN, JANTX, and JANTXV are available
by adding MQ, MX, or MV prefixes respectively to part
numbers. For example, designate a MXSMCJ5629A for
a JANTX screen.
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Working Standoff Voltages: 5.5 volts to 171 volts
Metallurgically bonded
For high reliability transient voltage suppression in
low profile surface mount locations requiring easy
placement and strain relief
Light weight for airborne or satellite applications
Superior surge quality to protect from ESD and EFT
transients per IEC61000-4-2 and -4-4
Lightning surge protection per IEC61000-4-5 for
Class 1 and 2 with source impedance of 42 Ohms as
well as Class 3 and 4 selectively at lower voltages
(V
WM
) and higher surge current (I
PP
) ratings herein
Protects sensitive components such as ICs, CMOS,
Bipolar, BiCMOS, ECL, DTL, T
2
L, etc.
MAXIMUM RATINGS
Operating temperature: -55°C to +150°C
Storage temperature: -55°C to +150°C
1500 Watts of Peak Pulse Power at 10/1000 µs as shown
in Figure 3 (see Figure 1 for other t
P
values)
Thermal resistance: 20°C/W Junction to Lead
Impulse repetition rate (duty factor): 0.01%
5.0 Watt steady-state maximum power at T
L
=25°C
t
clamping
(0V to V
(BR)
min): 50 picoseconds max (theoretical)
Forward voltage V
F
@ 100 Amps 8.3 ms: 3.5 V max
.
Solder Temperature: 260 °C for 10 s maximum
MICROSEMI
Part Number
Modified
“G”
Bend Lead
SMCG5629
SMCG5629A
SMCG5630
SMCG5630A
SMCG5631
SMCG5631A
SMCG5632
SMCG5632A
SMCG5633
SMCG5633A
SMCG5634
SMCG5634A
MICROSEMI
Part Number
Modified
“J”
Bend Lead
SMCJ5629
SMCJ5629A
SMCJ5630
SMCJ5630A
SMCJ5631
SMCJ5631A
SMCJ5632
SMCJ5632A
SMCJ5633
SMCJ5633A
SMCJ5634
SMCJ5634A
MECHANICAL AND PACKAGING
Molded epoxy package meets UL94V-0
Terminals: Tin-Lead or RoHS Compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
Body marked with P/N without SMCJ or SMCG letters
(ie. 5629A, 5640, 5655A, 5662, 5665A, etc.)
Cathode indicated by band
Weight: 0.25 grams (approximate)
Tape & Reel packaging per EIA-481
(2500 units/reel)
ELECTRICAL CHARACTERISTICS @ 25
o
C
Breakdown
Voltage*
(V
BR
)
MIN. MAX.
Vdc
Vdc
6.12
6.45
6.75
7.13
7.38
7.79
8.19
8.65
9.00
9.5
9.9
10.5
7.48
7.14
8.25
7.88
9.02
8.61
10.0
9.55
11.0
10.5
12.1
11.6
Test
Current
(I
(BR)
)
mAdc
10
10
10
10
10
10
1
1
1
1
1
1
Rated
Standoff
Voltage
(V
WM
)
V
5.50
5.80
6.05
6.40
6.63
7.02
7.37
7.78
8.10
8.55
8.92
9.40
Maximum
Standby
Current
(I
D
at V
WM
)
μAdc
1000
1000
500
500
200
200
50
50
10
10
5
5
SMCG/J5629 thru
SMCG/J5665A, e3
Maximum Peak
Reverse Voltage
(V
C
max. at I
PP
)
V
10.8
10.5
11.7
11.3
12.5
12.1
13.8
13.4
15.0
14.5
16.2
15.6
Maximum Peak
Pulse Current
(I
PP
)
A
139
143
128
132
120
124
109
112
100
103
93
96
Copyright
©
2007
6-21-2007 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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