Switches in momentary action HDT and latching action
Models
Construction
Dimensions
Drilling diagram
Drilling diagramm
= 1,25mm
Circuit diagram
NO
Z =
Drilling for pin location
fixed contact 1 pole
Small button:
cut out ø 8 mm
*Indication
area illuminated version
Large button:
cut out ø 10 mm
Drilling diagramm
= 1,25mm
NC
Z =
Drilling for pin location
fixed contact 1 pole
Small button:
cut out ø 8 mm
*Indication
area illuminated version
Large button:
cut out ø 10 mm
Drilling diagramm
= 1,25mm
NO/NC
Z =
Drilling for pin location
fixed contact 1 pole
Small button:
cut out ø 8 mm
*Indication
area illuminated version
Large button:
cut out ø 10 mm
10
Printmount Line
Technical Data HDT, HDS
1.
Mechanical data
Betätigungskraft
Actuating force
Schaltweg
Contact travel
End contact travel
(DIN 41640 T. 19)
/ End stop strength
(IEC 512-5 Test 9a)
/ Lifetime
IP 40
IP 65
waschdicht /
washproof
NO
NC
1,5 N ±0,3 N
2,5 N ±0,5 N
2,5 N ±0,3 N
1,2 mm ±0,2 mm
1,3 mm ±0,2 mm
2,5 mm ±0,1 mm
> 100 N
> 5 x 10
5
Operations
2.
Electrical data
Switching voltage max.
Switching current max.
Lifetime (rated interrupting capacity1,2 W)
(IEC 512-2, mV-Methode)
Initial contact resistance, new
Initial contact resistance, after 2 x 105 cycles
(IEC 512-2)
/ Insulation resistance
Contact bounce time
> 10
10
Ω
typ. 0,5 ms
PCB-mounting
CECC 00802
and
IEC 68-2-20
260 °C / 10 s
350 °C / 10 s
215 °C / 40 s
260 °C / 10 s
-40 °C…+85 °C
-40 °C…+85 °C
Zestron
IP65
given
IP40 / IP65
SMT-mounting
50 V DC / 60 V AC
200 mA
> 2 x 10
5
Cycles
< 30 mΩ
< 50 mΩ
3.
Other data
Solderability
Lötwärmebeständigkeit
IEC 68-2-20 Test Tb, Methode 1A
Soldering heat resistance
IEC 68-2-20 Test Tb, Methode 2
CECC 00802
Classification
B
CECC 00802
Classification
C
Ambient temperature
Storage temperature
(IEC 68-2-45) Testmedium
Cleaning agent proof
(DIN 41640 Teil 84)
/ Flux-proof
Degree of protection
4.
Materials
Thermoplast PA 4.6
Socket, cover, contact unit, carrier ring
Button non illuminated
Button illuminated
Sealing ring
Terminals
Contacts
Thermoplast PA 4.6
Thermoplast PES
Silicon
tempered
CuZn, 3 µm Ag,
hot tinned
CuBe2 HM, 5 µm Ag
5.
LED data
see page 38
Printmount Line
0925.9730
0925.9731
0925.9732
11