256-/1024-Bit Serial EEPROM
| NM93C13 | NM93C13M8 | NM93C13N | NM93C14M8 | NM93C14N | NM93C14TM8 | |
|---|---|---|---|---|---|---|
| 描述 | 256-/1024-Bit Serial EEPROM | 256-/1024-Bit Serial EEPROM | 256-/1024-Bit Serial EEPROM | 256-/1024-Bit Serial EEPROM | 256-/1024-Bit Serial EEPROM | 256-/1024-Bit Serial EEPROM |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 包装说明 | - | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | - | SOP, SOP8,.25 |
| Reach Compliance Code | - | unknow | unknow | unknow | - | unknown |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 数据保留时间-最小值 | - | 15 | 15 | 15 | - | 15 |
| 耐久性 | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | - | R-PDSO-G8 |
| JESD-609代码 | - | e0 | e0 | e0 | - | e0 |
| 长度 | - | 4.9 mm | 9.817 mm | 4.9 mm | - | 4.9 mm |
| 内存密度 | - | 256 bi | 256 bi | 1024 bi | - | 1024 bit |
| 内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | - | EEPROM |
| 内存宽度 | - | 16 | 16 | 16 | - | 16 |
| 功能数量 | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | - | 8 | 8 | 8 | - | 8 |
| 字数 | - | 16 words | 16 words | 64 words | - | 64 words |
| 字数代码 | - | 16 | 16 | 64 | - | 64 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 组织 | - | 16X16 | 16X16 | 64X16 | - | 64X16 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | SOP | DIP | SOP | - | SOP |
| 封装等效代码 | - | SOP8,.25 | DIP8,.3 | SOP8,.25 | - | SOP8,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE |
| 并行/串行 | - | SERIAL | SERIAL | SERIAL | - | SERIAL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 5.08 mm | 1.75 mm | - | 1.75 mm |
| 串行总线类型 | - | MICROWIRE | MICROWIRE | MICROWIRE | - | MICROWIRE |
| 最大待机电流 | - | 0.0002 A | 0.0002 A | 0.0002 A | - | 0.0002 A |
| 最大压摆率 | - | 0.004 mA | 0.004 mA | 0.004 mA | - | 0.004 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | YES | NO | YES | - | YES |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | THROUGH-HOLE | GULL WING | - | GULL WING |
| 端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | - | 3.9 mm | 7.62 mm | 3.9 mm | - | 3.9 mm |
| 写保护 | - | SOFTWARE | SOFTWARE | SOFTWARE | - | SOFTWARE |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
