LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | SOP, |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟（tpd） | 10 ns |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| 935218660112 | 74LVC374APW/AUJ | 935273479115 | 74LVC374ABQ | 935218660118 | |
|---|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 | flip flops octal D-type 5V inputs/outputs | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 |
| 包装说明 | SOP, | - | HVQCCN, | HVQCCN, LCC20,.1X.18,20 | SOP, |
| Reach Compliance Code | unknown | - | unknown | compliant | unknown |
| 系列 | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G20 | - | R-PQCC-N20 | R-PQCC-N20 | R-PDSO-G20 |
| JESD-609代码 | e4 | - | e4 | e4 | e4 |
| 长度 | 12.8 mm | - | 4.5 mm | 4.5 mm | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | - | 8 | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 20 | - | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | HVQCCN | HVQCCN | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 传播延迟（tpd） | 10 ns | - | 10 ns | 10 ns | 10 ns |
| 座面最大高度 | 2.65 mm | - | 1 mm | 1 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | - | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 1.27 mm | - | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | - | QUAD | QUAD | DUAL |
| 宽度 | 7.5 mm | - | 2.5 mm | 2.5 mm | 7.5 mm |
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