IA
NT
Features
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Industry standard SMT package
Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
6 A output current
Up to 92 % efficiency
Small size, low profile
Cost-efficient
PL
CO
M
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Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Sequencing function
*R
oH
S
MXT6A-12SA SMT Non-Isolated Power Module
Description
Bourns
®
MXT6A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features
such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
INPUT
Voltage
Current
Remote ON/OFF:
Low or Open =
High =
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
GENERAL
MTBF
Operating Temperature
Storage Temperature
Switching Frequency
Efficiency
(Vin = 12 Vdc, TA= 25 °C, Full Load)
-40
-55
300
81.0
84.0
86.0
88.0
90.0
92.0
Applications
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Min.
Nom.
Max.
Units
Notes
8.3
12
14
4.5
Vdc
Adc
Vdc
Vdc
Vdc
Adc
% Vo,set
% Vo,set
% Vo,set
% Vo,set
0 to +85 °C
1
µF
ceramic//10
µF
tantalum capacitors
1
µF
ceramic//10
µF
tantalum capacitors
1
µF
ceramic//10
µF
tantalum capacitors
2 x 150
µF
polymer capacitors
10
µA
max.
1 mA max.
Standard
On
Off
-P Option
Off
On
2.4
0.75
0.0
-2.0
0.3
0.4
0.4
50
15
200
25
50
50
10,000
0.4
Vin
5.5
6.0
2.0
75
30
mVpk-pk
mVrms
mV
µs
mV
µs
kHrs
+85
+125
°C
°C
kHz
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Intermediate Bus architecture
Distributed power applications
Workstations and servers
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Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Voltage Programming
Via external trim resistor between Trim and GND:
Rtrim =
Via application of external voltage between Trim and GND:
Vtrim = (0.7 - 0.0667 x {Vo - 0.7525})
[
10.5
- 1.0 kΩ
Vo - 0.7525
]
MXT6A-12SA SMT Non-Isolated Power Module
Product Dimensions
BOTTOM VIEW
27.9
(1.100)
4.06
(0.160)
4.83
(0.190)
4.06
(0.160)
4.57
(0.180)
4.57
(0.180)
4.06
(0.160)
Recommended Pad Layout
27.9
(1.100)
17.53
(0.690)
4.06
(0.160)
4.83
(0.190)
SEQ
8.89
(0.350)
GND
TRIM
VOUT
8.64
(0.340)
11.43
(0.450)
VOUT
TRIM
GND
SEQ
8.64
(0.340)
ON/OFF
0.25
(0.010)
VIN
8.89
(0.350)
VIN
1.57
(0.062)
2.29
(0.090)
ON/OFF
1.5
(0.06)
3.8
(0.150)
6.84
(0.270)
MAX.
6.56
(0.258)
REF.
1.5
(0.06)
1.5
(0.06)
RECOMMENDED PAD SIZE:
3.05
2.41
X
MIN.
(0.120) (0.095)
3.43
2.79
X
MAX.
(0.135) (0.110)
SIDE VIEW
DIMENSIONS:
MM
(INCHES)
Pick and Place Location
11.43
(0.450)
TOLERANCES:
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
6.22
(0.235)
L1 (REF.)
12.2
(0.480)
27.9
(1.100)
1.57
(0.062)
How to Order
M X T 6A - 12 S A (-P)
Configuration
• M = Surface Mount Device
Pinout Detail
PIN
1
2
3
4
5
6
FUNCTION
ON/OFF
VIN
SEQ
GND
TRIM
VOUT
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
Output Voltage (V)*
• A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Derating Output Current vs. Local Ambient Temp & Airflow
(Vin = 12 Vdc, Vo = 3.3 Vdc)
7
6
Output Current (A)
5
4
3
2
1
0
25
30
35
40
45
50
55
60
65
70
75
80
85
NC (0 LFM)
1.5 m/s
(300 LFM)
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
2.0 m/s
(400 LFM)
Ambient Temperature (°C)
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. B 08/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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