4M-BIT [x 1] CMOS SERIAL FLASH
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Macronix |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A991.B.1.B.1 |
| 最大时钟频率 (fCLK) | 85 MHz |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 4194304 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 1 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | 3-WIRE |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.012 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 类型 | NOR TYPE |
| 宽度 | 3.9 mm |
| 写保护 | HARDWARE/SOFTWARE |
| MX25L4005AMI-12G | MX25L4005AM2I-12G | MX25L4005AZMC-12G | MX25L4005AZMI-12G | MX25L4005AZNI-12G | MX25L4005AZUI-12G | |
|---|---|---|---|---|---|---|
| 描述 | 4M-BIT [x 1] CMOS SERIAL FLASH | 4M-BIT [x 1] CMOS SERIAL FLASH | 4M-BIT [x 1] CMOS SERIAL FLASH | 4M-BIT [x 1] CMOS SERIAL FLASH | 4M-BIT [x 1] CMOS SERIAL FLASH | 4M-BIT [x 1] CMOS SERIAL FLASH |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 零件包装代码 | SOIC | SOIC | QFN | QFN | QFN | SON |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.3 | HVSON, SOLCC8,.25 | HVSON, SOLCC8,.25 | HVSON, SOLCC8,.25 | HVSON, SOLCC8,.15,32 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 |
| 最大时钟频率 (fCLK) | 85 MHz | 85 MHz | 85 MHz | 85 MHz | 85 MHz | 85 MHz |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-XDSO-N8 | R-XDSO-N8 | R-PDSO-N8 | S-PDSO-N8 |
| 长度 | 4.9 mm | 5.28 mm | 6 mm | 6 mm | 6 mm | 4 mm |
| 内存密度 | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | HVSON | HVSON | HVSON | HVSON |
| 封装等效代码 | SOP8,.25 | SOP8,.3 | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.15,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 2.16 mm | 1 mm | 1 mm | 0.8 mm | 0.6 mm |
| 串行总线类型 | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE |
| 最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.012 mA | 0.012 mA | 0.015 mA | 0.012 mA | 0.012 mA | 0.012 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 3.9 mm | 5.23 mm | 5 mm | 5 mm | 5 mm | 4 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 数据保留时间-最小值 | 10 | 10 | - | 10 | 10 | 10 |
| JESD-609代码 | e3 | e3 | e3 | e3 | - | - |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - | - |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | - | - |
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