Frontier Electronics Corp.
667 E. COCHRAN STREET, SIMI VALLEY, CA 93065
TEL: (805) 522-9998
FAX: (805) 522-9989
E-mail:
frontiersales@frontierusa.com
Web:
http://www.frontierusa.com
ZENER DIODES
MMSZ5221B THRU MMSZ5259B
FEATURES
PLANAR DIE CONSTRUCTION
ULTRA-SMALL SURFACE MOUNT PACKAGE
GENERAL PURPOSE, MEDIUM CURRENT
IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES
CASE: SOD-123
UNIT:MM
MAXIMUM RATINGS ( T
AMB
=25℃ UNLESS OTHERWISE SPECIFIED )
CHARACTERISTIC
FORWARD VOLTAGE
POWER DISSIPATION (NOTE1)
I
F
=10mA
SYMBOL
V
F
P
d
R
θ
JA
T
J,TSTG
VALUE
0.9
350
357
- 65 TO + 150
UNIT
V
mW
K/W
℃
THERMAL RESISTANCE , JUNCTION TO AMBIENT AIR (NOTE1)
OPERATING AND STORAGE TEMPERATURE RANGE
2. TESTED WITH PULSES , Tp≦ 1.0ms
NOTE: 1. VALID PROVIDED THAT DEVICE TERMINALS ARE KEPT AT AMBIENT TEMPERATURE.
MMSZ5259B
Page: 1
ELECTRICAL CHARACTERISTICS (A
T
T
A
=25°C UNLESS OTHERWISE SPECIFIED)
ZENER VOLTAGE RANGE (NOTE 2)
TYPE
NUMBER
TYPE
CODE
NOM(V)
VZ@IZT
MIN(V)
MAX(V)
IZT
mA
MAXIMUM ZENER IMPEDANCE
ZZT@IZT
Ω
ZZK@IZK
IZK
mA
MAXIMUM REVERSE
LEAKAGE CURRENT
IR
VR
uA
V
MMSZ5221B
MMSZ5223B
MMSZ5225B
MMSZ5226B
MMSZ5227B
MMSZ5228B
MMSZ5229B
MMSZ5230B
MMSZ5231B
MMSZ5232B
MMSZ5233B
MMSZ5234B
MMSZ5235B
MMSZ5236B
MMSZ5237B
MMSZ5238B
MMSZ5239B
MMSZ5240B
MMSZ5241B
MMSZ5242B
MMSZ5243B
MMSZ5245B
MMSZ5246B
MMSZ5248B
MMSZ5250B
MMSZ5251B
MMSZ5252B
MMSZ5254B
MMSZ5255B
MMSZ5256B
MMSZ5257B
MMSZ5258B
MMSZ5259B
C1
C3
C5
G1
G2
G3
G4
G5
E1
E2
E3
E4
E5
F1
F2
F3
F4
F5
H1
H2
H3
H5
J1
J3
J5
K1
K2
K4
K5
M1
M2
M3
M4
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.0
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
15
16
18
20
22
24
27
28
30
33
36
39
2.28
2.57
2.85
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.70
5.89
6.46
7.13
7.79
8.27
8.65
9.50
10.45
11.40
12.35
14.25
15.20
17.10
19.00
20.90
22.80
25.65
26.60
28.50
31.35
34.20
37.05
2.52
2.84
3.15
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.30
6.51
7.14
7.88
8.61
9.14
9.56
10.50
11.55
12.60
13.65
15.75
16.80
18.90
21.00
23.10
25.20
28.35
29.40
31.50
34.65
37.80
40.95
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
8.5
7.8
7.0
6.2
5.6
5.2
5.0
4.5
4.2
3.8
3.4
3.2
30
30
30
28
24
23
22
19
17
11
7
7
5
6
8
8
10
17
22
30
13
16
17
21
25
29
33
41
44
49
58
70
80
1200
1300
1600
1600
1700
1900
2000
1900
1600
1600
1600
1000
750
500
500
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
700
700
800
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
100
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
3.5
4.0
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
11
12
14
15
17
18
21
21
23
25
27
30
NOTE: 1. DEVICE MOUNTED ON CERAMIC PCB；7.6mm x 9.4mm x 0.87mm WITH PAD AREAS 25 mm
2
.
2. TESTED WITH PULSES , Tp≦ 1.0ms.
FIG. 1 –FORWARD DISSIPATION VS
AMBIENT TEMPERATURE
0.6
POWER DISSIPATION (W)
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125 150
175
AMBIENT TEMPERATURE (
o
C)
MMSZ5259B
Page: 2
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