Freescale Semiconductor
Technical Data
Document Number: MMA25312B
Rev. 0, 9/2012
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
High Efficiency/Linearity Amplifier
The MMA25312B is a high efficiency InGaP HBT amplifier designed for
use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and
wireless broadband mesh networks. It is suitable for applications with
frequencies from 2300 to 2700 MHz using simple external matching
components with a 3 to 5 volt supply.
Features
•
Frequency: 2300--2700 MHz
•
P1dB: 31 dBm @ 2500 MHz
•
Power Gain: 26 dB @ 2500 MHz
•
OIP3: 40 dBm @ 2500 MHz
•
Active Bias Control (On--chip)
•
Single 3 to 5 Volt Supply
•
Single--ended Power Detector
•
Cost--effective QFN Surface Mount Package
•
In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7 inch Reel.
Table 1. Typical CW Performance
(1)
Characteristic
Small--Signal Gain
(S21)
Input Return Loss
(S11)
Output Return Loss
(S22)
Power Output @
1dB Compression
Symbol
G
p
IRL
ORL
P1dB
2300
MHz
26
--14
--11
30
2500
MHz
26
--12
--13
31
2700
MHz
24.5
--12
--15
29.8
Unit
dB
dB
dB
dBm
MMA25312BT1
2300-
-2700 MHz, 26 dB
31 dBm
InGaP HBT
CASE 2131-
-01
QFN 3×3
PLASTIC
Table 2. Maximum Ratings
Rating
Supply Voltage
Supply Current
RF Input Power
Storage Temperature Range
Junction Temperature
(2)
Symbol
V
CC
I
CC
P
in
T
stg
T
J
Value
6
550
30
--65 to +150
150
Unit
V
mA
dBm
°C
°C
2. For reliable operation, the junction temperature should not
exceed 150°C.
1. V
CC1
= V
CC2
= V
BIAS
= 5 Vdc, T
A
= 25°C, 50 ohm system, CW
Application Circuit
Table 3. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 91°C, V
CC1
= V
CC2
= V
BIAS
= 5 Vdc
Symbol
R
θJC
Value
(3)
92
Unit
°C/W
3. Refer to AN1955,
Thermal Measurement Methodology of RF Power Amplifiers.
Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
©
Freescale Semiconductor, Inc., 2012. All rights reserved.
MMA25312BT1
1
RF Device Data
Freescale Semiconductor, Inc.
Table 4. Electrical Characteristics
(V
CC1
= V
CC2
= V
BIAS
= 5 Vdc, 2500 MHz, T
A
= 25°C, 50 ohm system, in Freescale CW Application
Circuit)
Characteristic
Small--Signal Gain (S21)
Input Return Loss (S11)
Output Return Loss (S22)
Power Output @ 1dB Compression
Third Order Output Intercept Point, Two--Tone CW
Noise Figure
Supply Current
(1)
Supply Voltage
(1)
Symbol
G
p
IRL
ORL
P1dB
OIP3
NF
I
CQ
V
CC
Min
24.5
—
—
—
—
—
110
—
Typ
26
--12
--13
31
40
3.8
124
5
Max
—
—
—
—
—
—
138
—
Unit
dB
dB
dB
dBm
dBm
dB
mA
V
Table 5. ESD Protection Characteristics
Test Methodology
Human Body Model (per JESD 22--A114)
Machine Model (per EIA/JESD 22--A115)
Charge Device Model (per JESD 22--C101)
Class
2
A
IV
Table 6. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
1. For reliable operation, the junction temperature should not exceed 150°C.
Rating
1
Package Peak Temperature
260
Unit
°C
V
BA2
V
CC1
V
CC1
V
BA2
V
CC1
V
CC1
12
V
BA1
V
BIAS
RF
in
1
2
3
4
5
6
N.C. N.C. PDET
PDET
11
10
9
8
7
RF
out
RF
out
V
CC2
V
BA1
BIAS
CIRCUIT
RF
out
RF
out
V
BIAS
V
CC2
RF
in
Figure 1. Functional Block Diagram
Figure 2. Pin Connections
MMA25312BT1
2
RF Device Data
Freescale Semiconductor, Inc.
V
BIAS
L2
R1
R2
C1
Z2
C7
V
CC1
C2
12
1
BIAS
CIRCUIT
11
10
9
RF
OUTPUT
C13
C5
2
RF
INPUT
3
C8
DETECTOR
4
5
6
7
8
Z1
C11
V
CC2
C14
L3
P
DET
C9
Z1
Z2
0.140″ x 0.030″ Microstrip
0.073″ x 0.030″ Microstrip
Figure 3. MMA25312BT1 Test Circuit Schematic — 2500 MHz, 5 Volt Operation
Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation
Part
C1, C2
C3, C4, C6, C10, C12, C15
C5, C9
C7
C8, C13
C11
C14
L2
L3
R1
R2
R3
PCB
Description
1
μF
Chip Capacitors
Components Not Placed
100 pF Chip Capacitors
8.2 pF Chip Capacitor
22 pF Chip Capacitors
1.5 pF Chip Capacitor
4.7
μF
Chip Capacitor
1.2 nH Chip Inductor
22 nH Chip Inductor
430
Ω,
1/16 W Chip Resistor
1.6 kΩ, 1/16 W Chip Resistor
Component Not Placed
0.014″,
ε
r
= 3.7
FR408
Isola
GRM1555C1H101JA01
04023J8R2BBS
04023J22R0BBS
04023J1R5BBS
GRM188R60J475KE19D
LL1608-FH1N2S
LL1608-FH22N0S
RC0402JR-07430RL
RC0402JR-071K60L
Murata
AVX
AVX
AVX
Murata
TOKO
TOKO
Yageo
Yageo
Part Number
GRM155R61A105KE15
Manufacturer
Murata
Note: Component numbers C3, C4, C6, C10, C12, C15 and R3 are labeled on board but not placed.
Note: Component L1 intentionally omitted.
MMA25312BT1
RF Device Data
Freescale Semiconductor, Inc.
3
V
BIAS(1)
C1
R3*
R1
RF
IN
C5
C6*
C4*
C8
C9
V
CC1
C2
C3*
L2
R2
C7
C11
C12*
C13
RF
OUT
C10*
L3
C14
C15*
QFN 3x3--12N
Rev. 0
(1) V
BIAS
[Board] supplies V
BA1
, V
BA2
and V
BIAS
[Device].
Note: Component numbers C3*, C4*, C6*, C10*, C12*, C15* and R3* are labeled on board
but not placed.
Figure 4. MMA25312BT1 Test Circuit Component Layout — 2500 MHz, 5 Volt Operation
Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation
Part
C1, C2
C3, C4, C6, C10, C12, C15
C5, C9
C7
C8, C13
C11
C14
L2
L3
R1
R2
R3
PCB
Description
1
μF
Chip Capacitors
Components Not Placed
100 pF Chip Capacitors
8.2 pF Chip Capacitor
22 pF Chip Capacitors
1.5 pF Chip Capacitor
4.7
μF
Chip Capacitor
1.2 nH Chip Inductor
22 nH Chip Inductor
430
Ω,
1/16 W Chip Resistor
1.6 kΩ, 1/16 W Chip Resistor
Component Not Placed
0.014″,
ε
r
= 3.7
FR408
Isola
GRM1555C1H101JA01
04023J8R2BBS
04023J22R0BBS
04023J1R5BBS
GRM188R60J475KE19D
LL1608-FH1N2S
LL1608-FH22N0S
RC0402JR-07430RL
RC0402JR-071K60L
Murata
AVX
AVX
AVX
Murata
TOKO
TOKO
Yageo
Yageo
Part Number
GRM155R61A105KE15
Manufacturer
Murata
V
DECT
V
CC2
Note: Component L1 intentionally omitted.
(Component Designations and Values table repeated for reference.)
MMA25312BT1
4
RF Device Data
Freescale Semiconductor, Inc.
V
BIAS
L2
R1
R2
C1
Z2
C7
V
CC1
C2
12
1
BIAS
CIRCUIT
11
10
9
RF
OUTPUT
C13
C5
2
RF
INPUT
3
C8
DETECTOR
4
5
6
7
8
Z1
C11
V
CC2
C14
L3
P
DET
C9
Z1
Z2
0.140″ x 0.030″ Microstrip
0.073″ x 0.030″ Microstrip
Figure 5. MMA25312BT1 Test Circuit Schematic — 2500 MHz, 3.3 Volt Operation
Table 8. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 3.3 Volt Operation
Part
C1, C2
C3, C4, C6, C10, C12, C15
C5, C9
C7
C8, C13
C11
C14
L2
L3
R1
R2
R3
PCB
Description
1
μF
Chip Capacitors
Components Not Placed
100 pF Chip Capacitors
8.2 pF Chip Capacitor
22 pF Chip Capacitors
1.5 pF Chip Capacitor
4.7
μF
Chip Capacitor
1.2 nH Chip Inductor
22 nH Chip Inductor
100
Ω,
1/16 W Chip Resistor
470
Ω,
1/16 W Chip Resistor
Component Not Placed
0.014″,
ε
r
= 3.7
FR408
Isola
GRM1555C1H101JA01
04023J8R2BBS
04023J22R0BBS
04023J1R5BBS
GRM188R60J475KE19D
LL1608-FH1N2S
LL1608-FH22N0S
RC0402JR-07100RL
RC0402JR-07470RL
Murata
AVX
AVX
AVX
Murata
TOKO
TOKO
Yageo
Yageo
Part Number
GRM155R61A105KE15
Manufacturer
Murata
Note: Component numbers C3, C4, C6, C10, C12, C15 and R3 are labeled on board but not placed.
Note: Component L1 intentionally omitted.
MMA25312BT1
RF Device Data
Freescale Semiconductor, Inc.
5
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