Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SGD02N60
MA000269720
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.738
0.140
0.042
139.706
0.508
1.428
2.857
2.857
28.566
107.123
3.740
0.091
0.000
0.021
0.017
0.817
0.095
0.028
94.488
Average
Mass
[%]
0.19
0.04
0.01
36.46
0.13
0.37
0.75
0.75
7.45
27.95
0.98
0.02
0.00
0.01
0.00
0.21
0.02
0.01
24.65
29. August 2013
383.26 mg
Sum
[%]
0.19
Average
Mass
[ppm]
1926
365
110
36.51
0.13
364517
1326
3727
7453
7453
74534
37.27
0.98
279502
9758
237
0.02
1
56
45
0.22
2131
247
74
24.68
246538
246859
1000000
2232
238
372669
9758
364992
1326
Sum
[ppm]
1926
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
NXP MCU
京公网安备 11010802033920号
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