Freescale Semiconductor
Data Sheet: Technical Data
Document Number: KL14P80M48SF0
Rev. 3, 9/19/2012
KL14 Sub-Family Data Sheet
Supports the following:
MKL14Z32VFM4, MKL14Z64VFM4,
MKL14Z32VFT4, MKL14Z64VFT4,
MKL14Z32VLH4, MKL14Z64VLH4,
MKL14Z32VLK4, and MKL14Z64VLK4
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 48 MHz ARM® Cortex-M0+ core
• Memories and memory interfaces
– Up to 64 KB program flash memory
– Up to 8 KB RAM
• Clocks
– 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal
oscillator
– Multi-purpose clock source
• System peripherals
– Nine low-power modes to provide power
optimization based on application requirements
– 4-channel DMA controller, supporting up to 63
request sources
– COP Software watchdog
– Low-leakage wakeup unit
– SWD interface and Micro Trace buffer
– Bit Manipulation Engine (BME)
KL14P80M48SF0
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– General-purpose input/output
• Analog modules
– 12-bit SAR ADC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
• Timers
– Six channel Timer/PWM (TPM)
– Two 2-channel Timer/PWM (TPM)
– Periodic interrupt timers
– 16-bit low-power timer (LPTMR)
– Real-time clock
• Communication interfaces
– Two 8-bit SPI modules
– Two I2C modules
– One low power UART module
– Two UART modules
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................4
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................5
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............6
3.8 Definition: Typical value.....................................................7
3.9 Typical Value Conditions...................................................8
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................8
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................9
5.1 AC electrical characteristics..............................................9
5.2 Nonswitching electrical specifications...............................10
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
Voltage and current operating requirements.........10
LVD and POR operating requirements.................11
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............13
EMC radiated emissions operating behaviors.......20
5.2.7
5.2.8
Designing with radiated emissions in mind...........21
Capacitance attributes..........................................21
5.3 Switching specifications.....................................................21
5.3.1
5.3.2
Device clock specifications...................................21
General Switching Specifications..........................22
5.4 Thermal specifications.......................................................22
5.4.1
5.4.2
Thermal operating requirements...........................22
Thermal attributes.................................................22
6 Peripheral operating requirements and behaviors....................23
6.1 Core modules....................................................................23
6.1.1
SWD Electricals ...................................................23
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
6.3.2
MCG specifications...............................................25
Oscillator electrical specifications.........................27
6.4 Memories and memory interfaces.....................................29
6.4.1
Flash electrical specifications................................29
6.5 Security and integrity modules..........................................30
6.6 Analog...............................................................................31
6.6.1
6.6.2
ADC electrical specifications.................................31
CMP and 6-bit DAC electrical specifications.........33
6.7 Timers................................................................................35
6.8 Communication interfaces.................................................35
6.8.1
6.8.2
6.8.3
SPI switching specifications..................................35
I2C.........................................................................39
UART....................................................................39
7 Dimensions...............................................................................39
7.1 Obtaining package dimensions.........................................39
8 Pinout........................................................................................40
8.1 KL14 Signal Multiplexing and Pin Assignments................40
8.2 KL14 Pinouts.....................................................................42
9 Revision History........................................................................46
KL14 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
www.freescale.com
and perform a part number search for
the following device numbers: PKL14 and MKL14
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q KL## A FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
KL##
A
FFF
R
T
Qualification status
Kinetis family
Key attribute
Program flash memory size
Silicon revision
Temperature range (°C)
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• KL14
• Z = Cortex-M0+
• 32 = 32 KB
• 64 = 64 KB
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
Table continues on the next page...
KL14 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
Freescale Semiconductor, Inc.
3
Terminology and guidelines
Field
PP
Package identifier
Description
•
•
•
•
Values
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
LK = 80 LQFP (12 mm x 12 mm)
CC
N
Maximum CPU frequency (MHz)
Packaging type
• 4 = 48 MHz
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MKL14Z64VFT4
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
V
DD
Description
1.0 V core supply
voltage
0.9
Min.
1.1
Max.
V
Unit
3.2 Definition: Operating behavior
An
operating behavior
is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
KL14 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
4
Freescale Semiconductor, Inc.
Terminology and guidelines
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
I
WP
Description
Digital I/O weak pullup/ 10
pulldown current
Min.
130
Max.
µA
Unit
3.3 Definition: Attribute
An
attribute
is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
3.3.1 Example
This is an example of an attribute:
Symbol
CIN_D
Description
Input capacitance:
digital pins
—
Min.
7
Max.
pF
Unit
3.4 Definition: Rating
A
rating
is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
•
Operating ratings
apply during operation of the chip.
•
Handling ratings
apply when the chip is not powered.
3.4.1 Example
This is an example of an operating rating:
KL14 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
Freescale Semiconductor, Inc.
5
FPGA/CPLD
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