Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPU60R1K4C6
MA000984554
PG-TO251-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
plastics
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
antimonytrioxide
brominated resin
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1309-64-4
-
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.624
0.248
0.075
248.124
0.406
1.743
1.868
1.992
16.811
102.110
3.740
0.509
0.047
0.038
1.802
Average
Mass
[%]
0.43
0.07
0.02
65.10
0.11
0.46
0.49
0.52
4.41
26.79
0.98
0.13
0.01
0.01
0.47
29. August 2013
381.14 mg
Sum
[%]
0.43
Average
Mass
[ppm]
4261
652
196
65.19
0.11
651008
1066
4574
4901
5227
44107
32.67
0.98
0.13
267908
9813
1335
124
99
0.49
4729
4952
1000000
326717
9813
1335
651856
1066
Sum
[ppm]
4261
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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