Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K10P81M100SF2
Rev. 1, 11/2010
K10 Sub-Family Data Sheet
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
K10P81M100SF2
Supports the following:
MK10N512VLK100, MK10N512VMB100
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random-number generator
– 128-bit unique identification (ID) number per chip
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary
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Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
6.3.3
6.1 Core modules....................................................................19
6.1.1
6.1.2
Debug trace timing specifications.........................19
JTAG electricals....................................................20
6.2 System modules................................................................23
6.3 Clock modules...................................................................23
6.3.1
6.3.2
MCG Specifications...............................................23
Oscillator Electrical Characteristics.......................25
6.3.2.1
6.3.2.2
Oscillator DC Electrical Specifications 25
Oscillator frequency specifications......26
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical Value Conditions...................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 Nonswitching electrical specifications...............................11
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
Voltage and Current Operating Requirements......11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
5.1.5.1
Diagram: Typical IDD_RUN operating
behavior...............................................16
5.1.6
5.1.7
5.1.8
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
6.6.2
6.6.3
5.2 Switching electrical specifications.....................................18
5.3 Thermal specifications.......................................................18
5.3.1
5.3.2
Thermal operating requirements...........................18
Thermal attributes.................................................19
6.6.4
6 Peripheral operating requirements and behaviors....................19
2
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6.3.3.1
6.3.3.2
6.4.1
6.4.1.1
6.4.1.2
6.4.1.3
6.4.1.4
6.4.2
6.4.3
6.6.1
6.6.1.1
6.6.1.2
6.6.1.3
6.6.1.4
6.6.3.1
6.6.3.2
32kHz Oscillator Electrical Characteristics............27
32kHz Oscillator DC Electrical
Specifications......................................27
32kHz Oscillator Frequency
Specifications......................................27
6.4 Memories and memory interfaces.....................................28
Flash (FTFL) Electrical Characteristics.................28
Flash Timing Parameters — Program
and Erase............................................28
Flash Timing Parameters —
Commands..........................................28
Flash (FTFL) Current and Power
Parameters..........................................29
Reliability Characteristics....................29
EzPort Switching Specifications............................29
Flexbus Switching Specifications..........................30
6.5 Security and integrity modules..........................................32
6.6 Analog...............................................................................32
ADC electrical specifications.................................32
16-bit ADC operating conditions..........33
16-bit ADC electrical characteristics....35
16-bit ADC with PGA operating
conditions............................................38
16-bit ADC with PGA characteristics...39
CMP and 6-bit DAC electrical specifications.........40
12-bit DAC electrical characteristics.....................41
12-bit DAC operating requirements.....41
12-bit DAC operating behaviors..........42
Voltage Reference Electrical Specifications..........44
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................45
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
6.8.1
DSPI Switching Specifications for Low-speed
Operation..............................................................46
6.9.2
TSI Electrical Specifications..................................52
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................53
8 Pinout........................................................................................54
8.1 K10 Signal Multiplexing and Pin Assignments..................54
8.2 K10 Pinouts.......................................................................57
9 Revision History........................................................................58
6.8.2
DSPI Switching Specifications (High-speed
mode)....................................................................47
6.8.3
6.8.4
SDHC Specifications.............................................49
I2S Switching Specifications.................................50
6.9 Human-machine interfaces (HMI)......................................52
6.9.1
General Switching Specifications..........................52
Freescale Semiconductor, Inc.
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K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
www.freescale.com
and perform a part number search for
the following device numbers: PK10 and MK10.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
M
Qualification status
Kinetis family
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K10
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
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K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
FFF
Description
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
Values
T
PP
Temperature range (°C)
Package identifier
• V = –40 to 105
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
FX = 64 QFN (9 mm x 9 mm)
LH = 64 LQFP (10 mm x 10 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
ML = 104 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MF = 196 MAPBGA (15 mm x 15 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
50 = 50 MHz
72 = 72 MHz
100 = 100 MHz
120 = 120 MHz
150 = 150 MHz
CCC
Maximum CPU frequency (MHz)
N
Packaging type
2.4 Example
This is an example part number:
MK10N512VMD100
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
Freescale Semiconductor, Inc.
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• R = Tape and reel
• (Blank) = Trays
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
5
MEMS传感器
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