INCH-POUND
MIL-M-38510/14E
21 March 2005__
SUPERSEDING
MIL-M-38510/14D
2 August 1982
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, TTL, DATA SELECTORS/MULTIPLEXERS,
MONOLITHIC SILICON
Inactive for new design after 7 September 1995.
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic, silicon, TTL, data
selectors/multiplexers, logic microcircuits. Two product assurance classes and a choice of case outlines and lead
finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-
38510 have been superseded by MIL-PRF-38535, (see 6.4).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
01
02, 06
03
04
05
Circuit
Sixteen-input data selector/multiplexer, with enable
Eight-input data selector/multiplexer, with enable
Dual, four-input data selector/multiplexer, with enable
Dual, four-input data selector/multiplexer, without enable
Quad, two-input data selector/multiplexer, with enable
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
J
K
Z
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
GDIP1-T24 or CDIP2-T24
GDFP2-F24 or CDFP3-F24
GDFP7-F24 or CDFP8-F24
Terminals
16
16
24
24
24
Package style
Dual-in-line
Flat-pack
Dual-in-line
Flat-pack
Flat-pack
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to
bipolar@dscc.dla.mil.
Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at
http://assist.daps.dla.mil.
AMSC N/A
FSC 5962
MIL-M-38510/14E
1.3 Absolute maximum ratings.
Supply voltage range ......................................................
Input voltage range .........................................................
Storage temperature range ............................................
Maximum power dissipation per gate, (P
D
) 1/
Device type 01 ........................................................
Device types 02 and 06 ...........................................
Device type 03 ........................................................
Device type 04 ........................................................
Device type 05 ........................................................
Lead temperature (soldering 10 seconds) ......................
Thermal resistance, junction-to-case (θ
JC
)......................
Junction temperature (T
J
)
2/
..........................................
1.4 Recommended operating conditions.
Supply voltage (V
CC
) .......................................................
Minimum high level input voltage (V
IH
) ...........................
Maximum low level input voltage (V
IL
) ............................
Maximum low level output current (I
IL
) ............................
Normalized fanout (each output) 3/
Low logic level .........................................................
High logic level ........................................................
Case operating temperature range (T
C
) .........................
2.0 APPLICABLE DOCUMENT
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
4.5 V minimum to 5.5 V maximum
2.0 V dc
0.8 V dc
16 mA
10 maximum
20 maximum
-55°C to 125°C
-0.5 V to +7.0 V
-1.5 V at -12 mA to +5.5 V
-65°C to +150°C
375 mW
268 mW
286 mW
248 mW
275 mW
300°C
(See MIL-STD-1835)
175°C
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
_______
1/ Must withstand the added P
D
due to short circuit condition (e.g. I
OS
test).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ Device will fanout in both high and low levels to the specified number of inputs of the same device type
as that being tested.
2
MIL-M-38510/14E
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagrams and terminal connections. The logic diagrams and terminal connections shall be as
specified on figure 1 and 2.
3.3.2 Truth tables. The truth tables shall be as specified on figure 3.
3.3.4 Schematic circuit. The schematic circuit shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity upon request.
3.3.5 Case outlines. Case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 4 (see MIL-PRF-38535, appendix A).
3
MIL-M-38510/14E
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
V
CC
= 4.5 V
I
OH
= -.8 mA
Low level output voltage
Input clamp voltage
V
OL
V
IC
I
IL
V
CC
= 4.5 V
I
OL
= 16 mA
V
CC
= 4.5 V
I
IN
= -12 mA
Low level input current
V
CC
= 5.5 V
V
IN
= 0.4 V
High-level input current
High-level input current
Short circuit output current
02, 03,
04
05, 06
01
All
All
01, 03,
06
02, 04,
05
01
02,06
04
03
05
01
01
01
01
01
01
-20
-20
-0.7
-1.6
mA
All
-1.5
V
All
0.4
V
Device
type
All
Limits
Min
Max
2.4
Unit
High level output voltage
V
OH
V
-0.6
-1.6
40
100
-55
-120
68
48
45
52
50
40
43
37
32
23
30
µA
µA
mA
mA
mA
mA
mA
mA
mA
ns
ns
ns
ns
ns
ns
I
IH1
I
IH2
I
OS
V
CC
= 5.5 V
V
IN
= 2.5 V
V
CC
= V
IN
= 5.5 V
V
CC
= 5.5 V
V
OUT
= 0 V 1/
Supply current
I
CC
V
CC
= 5.5 V
Propagation delay time high-to-low
level output from A, B, C or D to W
Propagation delay time low-to-high
level output from A, B, C or D to W
Propagation delay time high-to-low
level output from strobe to W
Propagation delay time low-to-high
level output from strobe to W
Propagation delay time high-to-low
level output from E
0
–E
15
to W
Propagation delay time low-to-high
level output from E
0
–E
15
to W
t
PHL1
t
PLH1
t
PHL2
t
PLH2
t
PHL3
t
PLH3
R
L
= 390Ω ±5%,
C
L
= 50 pF minimum
(figure 4)
8
8
6
6
3
3
1/ Not more than one should be shorted at one time.
4
MIL-M-38510/14E
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
R
L
= 390Ω ±5%,
C
L
= 50 pF minimum
(figure 4)
Device
type
02
06
02
06
02
06
02
06
02
06
02, 06
02
06
02
06
02, 06
02, 06
02
06
t
PLH6
t
PHL1
t
PLH1
t
PHL2
t
PLH2
t
PHL3
t
PLH3
R
L
= 390Ω ±5%,
C
L
= 50 pF minimum
(figure 5)
02
06
03
03
03
03
03
03
Limits
Min
Max
6
6
6
6
8
8
8
8
6
6
6
8
8
8
8
3
3
6
6
6
6
3
3
6
6
6
6
40
48
38
43
49
60
45
58
37
38
35
46
52
42
52
32
26
41
44
33
36
29
28
44
42
32
42
ns
ns
ns
ns
ns
ns
ns
Test
Propagation delay time, high-to-low
level output from A, B, or C to W
Propagation delay time, low-to-high
level output from A, B, or C to W
Propagation delay time, high-to-low
level output from A, B, or C to Y
Propagation delay time, low-to-high
level output from A, B, or C to Y
Propagation delay time, high-to-low
level output from strobe to W
Propagation delay time, low-to-high
level output from strobe to W
Propagation delay time, high-to-low
level output from strobe to Y
Propagation delay time, low-to-high
level output from strobe to Y
Propagation delay time, high-to-low
level output from D
0
-D
7
to W
Propagation delay time, low-to-high
level output from D
0
-D
7
to W
Propagation delay time, high-to-low
level output from D
0
-D
7
to Y
Propagation delay time, low-to-high
level output from D
0
-D
7
to Y
Propagation delay time, high-to-low
level output from data to Y
Propagation delay time, low-to-high
level output from data to Y
Propagation delay time, high-to-low
level output from A or B to Y
Propagation delay time, low-to-high
level output from A or B to Y
Propagation delay time, high-to-low
level output from strobe to Y
Propagation delay time, low-to-high
level output from strobe to Y
Symbol
t
PHL1
t
PLH1
t
PHL2
t
PLH2
t
PHL3
t
PLH3
t
PHL4
t
PLH4
t
PHL5
t
PLH5
t
PHL6
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
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