Features
NT
S
CO
M
PL
Applications
Used as a secondary overcurrent protection
device in:
■
Customer Premise Equipment (CPE)
■
Central Office (CO)
■
Access equipment
■
■
■
Two resistance-matched PTCs in a
plastic housing
Narrow resistance tolerance
RoHS compliant*
*R
oH
IA
CMF-SDP Series - Telecom CPTC Resettable Fuses
Electrical Characteristics
Typical
Time to Trip
Imax @
@ Imax/
230 VAC
230 VAC
Amps
Seconds
Model
Induction
Voltage
Withstand
VAC
Rated
Voltage
Volts
Rated
Resistance
(RN)
Ohms
Tolerance
Resistance
Matching
In Housing
Ohms
Hold
Current
Trip
Current
Amps @ 25 °C Amps @ 25 °C
CMF-SDP07
CMF-SDP10
CMF-SDP10A
CMF-SDP25
CMF-SDP25A
CMF-SDP35
CMF-SDP35A
CMF-SDP50
CMF-SDP50A
CMF-SDP75
600
600
600
600
600
600
600
600
600
600
230
230
230
230
230
230
230
230
230
230
7
10
10
25
25
35
35
50
50
75
±20 %
±20 %
±20 %
±20 %
±20 %
+15/-20 %
+15/-20 %
±15 %
±15 %
±20 %
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±1
0.150
0.180
0.150
0.130
0.130
0.110
0.110
0.090
0.090
0.070
0.350
0.360
0.360
0.260
0.260
0.230
0.230
0.190
0.190
0.150
3.0
1.0
1.0
2.8
2.8
4.6
4.6
2.5
2.5
2.5
0.45
3.8
3.8
0.2
0.3
0.06
0.04
0.13
0.1
0.12
Operating Temperature Range: -40°C to +125 °C
Test Procedures And Requirements For Model CMF-SDP Series
Primary
Test
Protection
Test Condition
Requirements
Mains Power Contact - ITU-T K.20, K.21 ....None................230 V rms, 10 ohms, 15 Min. ......................................................(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............None................600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ......................................10/700
µs,
25 ohms, 1.0 kV, 10 Tests, every 1 Min. ..................(Ri-Rf) / Ri < ±10 %
Lightning Surge......................................................................10/100
µs,
25 ohms, 1.5 kV, 30 Tests, every 3 Min. ..................(Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R final
Typical Part Marking
Represents total content. Layout may vary.
PART
IDENTIFICATION:
07P = CMF-SDP07
10P = CMF-SDP10
10PA = CMF-SDP10A
25P = CMF-SDP25
25PA = CMF-SDP25A
35P = CMF-SDP35
35PA = CMF-SDP35A
50P = CMF-SDP50
50PA = CMF-SDP50A
75P = CMF-SDP75
MANUFACTURER'S
TRADEMARK
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
YEAR CODE:
8 = 2008
How to Order
CMF - SD P 35 A -XX - 2
Product Designator
Style
SD = Surface Mount
Dual Pkg.
Housing
P = Plastic
Rated Resistance (RN)
7-75 (7-75 Ohms)
Footprint and Height Option
Blank = Standard Product
A = Reduced Footprint and Height
Resistance Tolerance Option
Blank = Standard
-XX = XX %; e.g. -10 = ±10 %
Packaging Options
- 2 = Tape & Reel
35P8G
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
250
200
150
100
50
0
160–220
10–20
Time (seconds)
120
Preheating
Soldering
Cooling
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
Temperature (°C)
Product Dimensions
CMF-SDP07, 10, 25, 35, 50 & 75
CMF-SDP10A, 25A, 35A & 50A
8.75
(.344) MAX.
11.5
(.453)
MAX.
10.2
(402)
MAX.
9.0
MAX.
(.354)
2.6
(.102)
5.0
(.197)
11.0
MAX.
(.433)
2.4
(.094)
3.9
(.154)
0.5
(.020)
2 PLCS.
7.2
MAX.
(.283)
Recommended Pad Layout
9.0
(.354)
Recommended Pad Layout
7.2
(.283)
MAX.
MAX.
8.75
(.344)
11.0
(.433)
7.6
(.299)
5.0
(.197)
3.9
(.154)
6.3
(.248)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
8.2
(.323)
3.2
(.126)
2.4
(.094)
2.0
(.079)
DIMENSIONS =
MM
(INCHES)
Packaging options: TAPE & REEL: 350 pcs. per reel
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SDP Series Tape and Reel Specifications
Tape Dimensions per EIA 481-2
CMF-SDP10-2, CMF-SDP25-2,
CMF-SDP-35-2, CMF-SDP50-2,
CMF-SDP75-2
24.0 ±0.5
(0.945 ±0.020 )
4.0
(0.157)
16.0
(0.630)
2.0
(0.079)
9.1 ± 0.2
(0.358 ± 0.008)
11.20 ± 0.2
(0.441 ± 0.008)
1.5
(0.059)
11.5
(0.453)
1.75
(0.069)
0.5 ± 0.15
(0.020 ± 0.006)
11.7 ± 0.2
(0.433 ± 0.008)
CMF-SDP10A-2, CMF-SDP25A-2,
CMF-SDP35A-2, CMF-SDP50A-2
24.0 ±0.5
(0.945 ±0.020 )
4.0
(0.157)
16.0
(0.630)
2.0
(0.079)
7.5 ± 0.2
(0.295 ± 0.008)
9.0 ± 0.2
(0.354 ± 0.008)
1.5
(0.059)
11.5
(0.453)
1.75
(0.069)
0.5 ± 0.15
(0.020 ± 0.006)
10.0 ± 0.2
(0.394 ± 0.008)
W
P0
P
P2
A0
B0
D0
F
E1
t1
K0
D
P2
P0
E
T
-0.4
(-.016)
F
W
B0
P
A0
K0
DIMENSIONS =
MM
(INCHES)
330 -2/+0
(12.99 -.079/+0)
DIA.
24.4
(.961)
MIN.
30.4
(1.197)
MAX.
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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