Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-C164CI-8EM DB
MA001053054
PG-MQFP-80-7
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
52.594
0.349
1.511
6.975
223.668
3.387
2.011
85.137
583.220
9.487
3.927
1.669
6.676
Average
Mass
[%]
5.36
0.04
0.15
0.71
22.81
0.35
0.21
8.68
59.47
0.97
0.40
0.17
0.68
29. August 2013
980.61 mg
Sum
[%]
5.36
Average
Mass
[ppm]
53634
356
1541
7113
23.71
0.35
228090
3454
2051
86820
68.36
0.97
0.40
594751
9675
4005
1702
0.85
6808
8510
1000000
683622
9675
4005
237100
3454
Sum
[ppm]
53634
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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