MCL103A, MCL103B, MCL103C
Vishay Semiconductors
Small Signal Schottky Diodes
Features
• Integrated protection ring against static
discharge
• Low capacitance
• Low leakage current
• Low forward voltage drop
• AEC-Q101 qualified
• Compliant to RoHS directive 2002/95/EC
and in accordance to WEEE 2002/96/EC
• Halogen-free according to IEC 61249-2-21
definition
9612315
Applications
•
•
•
•
IHF-Detector
Protection circuit
Small battery charger
AC-DC/DC-DC converters
Mechanical Data
Case:
MicroMELF
Weight:
approx. 12 mg
Cathode band color:
black
Packaging codes/options:
TR3/10 k per 13" reel (8 mm tape), 10 k/box
TR/2.5 k per 7" reel (8 mm tape), 12.5 k/box
Parts Table
Part
MCL103A
MCL103B
MCL103C
Type differentiation
V
R
= 40 V
V
R
= 30 V
V
R
= 20 V
Ordering code
MCL103A-TR3 or MCL103A-TR
MCL103B-TR3 or MCL103B-TR
MCL103C-TR3 or MCL103C-TR
Remarks
Tape and Reel
Tape and Reel
Tape and Reel
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Parameter
Reverse voltage
Test condition
Part
MCL103A
MCL103B
MCL103C
Forward continuous current
Peak forward surge current
Power dissipation
t
p
= 300 µs, square pulse
Symbol
V
R
V
R
V
R
I
F
I
FSM
P
tot
Value
40
30
20
200
15
400
Unit
V
V
V
mA
A
mW
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Thermal resistance junction to
ambient air
Junction temperature
Storage temperature range
Test condition
On PC board
50 mm x 50 mm x 1.6 mm
Symbol
R
thJA
T
j
T
stg
Value
250
125
- 65 to + 150
Unit
K/W
°C
°C
Document Number 85632
Rev. 1.6, 05-Aug-10
For technical questions within your region, please contact one of the following:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
1
MCL103A, MCL103B, MCL103C
Vishay Semiconductors
Electrical Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Reverse Breakdown Voltage
Test condition
I
R
= 10 µA
V
R
= 30 V
Leakage current
V
R
= 20 V
V
R
= 10 V
Forward voltage drop
Diode capacitance
Reverse recovery time
I
F
= 20 mA
I
F
= 200 mA
V
R
= 0 V, f = 1 MHz
I
F
= I
R
= 50 to 200 mA,
recover to 0.1 I
R
Part
MCL103A
MCL103B
MCL103C
MCL103A
MCL103B
MCL103C
Symbol
V
(BR)
V
(BR)
V
(BR)
I
R
I
R
I
R
V
F
V
F
C
D
t
rr
50
10
Min.
40
30
20
5
5
5
370
600
Typ.
Max.
Unit
V
V
V
µA
µA
µA
mV
mV
pF
ns
Typical Characteristics
T
amb
= 25 °C, unless otherwise specified
1000
100
10
1
10 000
I
F
- Forward Current (mA)
I
R
- Reverse Current (µA)
1000
100
0.1
0.01
0.001
0 100 200 300 400 500 600 700
800
900 1000
10
1
0
16767
20
40
60
80
100
120
140
160
16765
V
F
- Forward
Voltage
(mV)
T
j
- Junction Temperature (°C)
Figure 1. Forward Current vs. Forward Voltage
Figure 3. Reverse Current vs. Junction Temperature
5
30
f = 1 MHz
C
D
- Diode Capacitance (pF)
I
F
- Forward Current (A)
4
25
20
15
10
5
0
3
2
1
0
0.0
16766
0.5
1.0
1.5
2.0
16768
0
5
10
15
20
25
30
V
F
- Forward
Voltage
(V)
V
R
- Reverse
Voltage
(V)
Figure 2. Forward Current vs. Forward Voltage
Figure 4. Diode Capacitance vs. Reverse Voltage
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2
For technical questions within your region, please contact one of the following: Document Number 85632
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Rev. 1.6, 05-Aug-10
MCL103A, MCL103B, MCL103C
Vishay Semiconductors
25
I
tot
- Typ.
Non
Repetitve
Forward Surge Current (A)
20
15
10
5
0
0.1
16769
1.0
10.0
t
P
- Pulse
width
(ms)
Figure 5. Typ. Non Repetitive Forward Surge Current vs.
Pulse width
Package Dimensions
in millimeters (inches):
MicroMELF
Cathode indification
1 (0.039)
surface plan
<
surface plan
1.2 (0.047)
1.1 (0.043)
35
gl
(0
as
.0
s
53
1.
)
*
2 (0.079)
1.8 (0.071)
0.25 (0.010)
0.15 (0.006)
> R2.5 (0.098)
glass
*
The gap
between
plug and glass can
be
either on cathode or anode side
Foot print recommendation:
Reflow soldering
2.4 (0.094)
0.8 (0.031)
0.8 (0.031)
0.9 (0.035)
Wave
soldering
2.8 (0.110)
0.9 (0.035)
1.2 (0.047)
0.8 (0.031)
1 (0.039)
Created - Date: 26.July.1996
Rev. 13 - Date: 07.June.2006
Document no.:6.560-5007.01-4
96 12072
Document Number 85632
Rev. 1.6, 05-Aug-10
1.4 (0.055)
For technical questions within your region, please contact one of the following:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
0.6 (0.024)
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3
MiniMELF SOD80
Vishay Semiconductors
PACKAGE DIMENSIONS
in millimeters (inches)
Cathode indification
*
0.47 (0.019) max.
3.7 (0.146)
3.3 (0.130)
* The gap
between
plug and glass can
be
either on cathode or anode side
Foot print recommendation:
2.5 (0.098) max.
1.25 (0.49) min.
1.6 (0.063)
1.4 (0.055)
5 (0.197) ref.
Document no.:6.560-5005.01-4
Rev.
8
- Date: 07.June.2006
96 12070
Document Number: 84024
Rev. 1.3, 12-Jan-07
For technical questions, contact: EMI-filter@vishay.com
2 (0.079) min.
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21
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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1