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MCIMX25_1004: 产品描述i.MX25 Applications Processor for Consumer and Industrial Products; 文件大小2MB，共144页; 制造商FREESCALE (NXP)

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MCIMX25_1004概述

i.MX25 Applications Processor for Consumer and Industrial Products

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MCIMX25

i.MX25 Applications

Processor for Consumer

and Industrial Products

Silicon Version 1.1

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Case 2107 12 x 12 mm, 0.5 mm Pitch

Ordering Information

See

Table 1 on page 3

for ordering information.

Introduction

The i.MX25 multimedia applications processor has

the right mix of high performance, low power, and

integration to support the growing needs of the

industrial and general embedded markets.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM926EJ-S core, with speeds of up to 400 MHz.

The i.MX25 includes support for up to 133-MHz

DDR2 memory, integrated 10/100 Ethernet MAC,

and two on-chip USB PHYs. The device is suitable

for a wide range of applications, including the

following:

• Graphical remote controls

• Human machine interface (HMI)

• Residential and commercial control panels

• Residential gateway (smart metering)

• Handheld scanners and printers

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9

3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2. Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 17

3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18

3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19

3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24

3.7. Module Timing and Electrical Parameters . . . . . . 42

4. Package Information and Contact Assignment . . . . . . 123

4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 123

4.2. Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 124

4.3. Signal Contact Assignments—17x17 mm,

0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 129

4.5. 347 MAPBGA—Case 12x12 mm,

0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

4.6. Ground, Power, Sense, and Reference Contact

Assignments Case 12x12 mm, 0.5 mm Pitch . . . 133

4.7. Signal Contact Assignments—12x12 mm,

0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 137

5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not

available from Freescale for import or sale in the United States prior to September 2010: MCIMX253DVM4, MCIMX257DVM4, MCIMX253CVM4, MCIMX257CVM4,

and MCIMX258CVM4.

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25CEC

Rev. 3, 04/2010

Features of the i.MX25 processor include the following:

• Advanced power management—The heart of the device is a level of power management

throughout the IC that enables the multimedia features and peripherals to achieve minimum system

power consumption in active and various low-power modes. Power management techniques allow

the designer to deliver a feature-rich product that requires levels of power far lower than typical

industry expectations.

• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a

16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with

alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen

controller), and a programmable smart DMA (SDMA) controller.

• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for

eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows

the designer to enable an ultra low power LCD refresh.

• Interface flexibility—The device interface supports connection to all common types of external

memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,

and managed NAND.

• Increased security—Because the need for advanced security for tethered and untethered devices

continues to increase, the i.MX25 processor delivers hardware-enabled security features that

enable secure e-commerce, digital rights management (DRM), information encryption, robust

tamper detection, secure boot, and secure software downloads.

• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.

• Fast Ethernet—For rapid external communication, a fast Ethernet controller (FEC) is included.

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 3

Freescale Semiconductor

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not

available from Freescale for import or sale in the United States prior to September 2010: MCIMX253DVM4, MCIMX257DVM4, MCIMX253CVM4, MCIMX257CVM4,

and MCIMX258CVM4.

•

Electronic point-of-sale terminals

Patient-monitoring devices

MCIMX25_1004相似产品对比

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MCIMX25_1004

MCIMX25_1004概述

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