Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
SOT23
Junction-to-Ambient Thermal Resistance (θ
JA
) .....255.9°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............81°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
IN
= +3.6V, V
GND
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
Input Voltage (Note 3)
Output Voltage
Adjustable Output Voltage
Range (Note 4)
Maximum Output Current
Current Limit (Note 5)
Ground Pin Current
Dropout Voltage (Note 6)
Line Regulation
Load Regulation
Output Voltage Noise
SHUTDOWN
SHDN
Input Threshold
V
IH
V
IL
2.0
0.4
V
∆V
LNR
∆V
LDR
I
LIM
I
Q
SET = GND
I
OUT
= 1mA
I
OUT
= 50mA
V
IN
= 2.5V to 6.5V, SET tied to OUT,
I
OUT
= 1mA
I
OUT
= 0mA to
50mA
10Hz to 1MHz
SET = GND
SET tied to OUT
C
OUT
= 1µF
C
OUT
= 100µF
-0.15
I
LOAD
= 0mA
I
LOAD
= 50mA
SYMBOL
V
IN
V
OUT
0mA ≤ I
OUT
≤
50mA, SET = GND
MAX886_T
MAX886_S
MAX886_R
CONDITIONS
MIN
2.5
3.05
2.75
2.70
V
SET
120
280
68
80
1.1
55
0
0.011
0.006
350
220
120
+0.15
0.040
150
3.15
2.84
2.80
TYP
MAX
6.5
3.25
2.93
2.88
6.5
V
mA
mA
µA
mV
%/V
%/mA
µV
RMS
V
UNITS
V
V
OUT
www.maximintegrated.com
Maxim Integrated
│
2
MAX8863T/S/R,
MAX8864T/S/R
Electrical Characteristics (continued)
Low-Dropout, 120mA Linear Regulators
(V
IN
= +3.6V, V
GND
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
SHDN
Input Bias Current
Shutdown Supply Current
Shutdown Discharge Resistance
(MAX8864)
SET INPUT
Set Reference Voltage
(Note 4)
Set Input Leakage Current
(Note 4)
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
T
SHDN
∆T
SHDN
170
20
°C
°C
V
SET
V
IN
= 2.5V to 6.5V,
I
OUT
= 1mA
V
SET
= 1.3V
T
A
= +25°C
E temp range
M temp range
T
A
= +25°C
T
A
= T
MAX
1.225
1.215
1.205
1.25
1.25
1.25
0.015
0.5
1.275
1.285
1.285
2.5
nA
V
SYMBOL
I
SHDN
I
QSHDN
V
SHDN
= V
IN
V
OUT
= 0V
CONDITIONS
T
A
= +25°C
T
A
= T
MAX
T
A
= +25°C
T
A
= T
MAX
MIN
TYP
0
0.05
0.0001
0.02
300
1
MAX
100
UNITS
nA
µA
Ω
I
SET
Note 2:
Limits are 100% production tested at T
A
= +25°C. Limits over the operating temperature range are guaranteed through cor-
relation using Statistical Quality Control (SQC) Methods.
Note 3:
Guaranteed by line regulation test.
Note 4:
Adjustable mode only.
Note 5:
Not tested. For design purposes, the current limit should be considered 120mA minimum to 420mA maximum.
DLNA（Digital Living Network Alliance，数字生活网络联盟）于2003年6月24日由富士通、惠普、英特尔、联想、IBM、Kenwood、 松下、微软、NEC、诺基亚、飞利浦、三星、Sharp、索尼、STMicroe lectronics和Thomson 17家公司发起成立。其前身名为数字家庭工作组DHWG（Digital Home Working Group...[详细]
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