The MAX71020 is a single-chip analog front-end (AFE)
for use in high-performance revenue meters. It contains
the compute engine (CE) found in Maxim Integrated’s
fourth-generation meter system-on-chip (SoC) and an
improved analog-to-digital converter (ADC), and inter-
faces to the host controller of choice over a SPI interface.
The MAX71020 comes in a 28-pin TSSOP package.
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Features
0.1% Accuracy Over 2000:1 Current Range
Exceeds IEC 62053/ANSI C12.20 Standards
Two Differential Current Sensor Inputs
Two Voltage Sensor Inputs
Selectable Gain of 1 or 8.9 for One Current Input
to Support a Shunt
High-Speed Wh/VARh Pulse Outputs with
Programmable Width
Up to Four Pulse Outputs with Pulse Count
Four-Quadrant Metering
Digital Temperature Compensation
Independent 32-Bit Compute Engine
45Hz to 65Hz Line Frequency Range with Same
Calibration
Phase Compensation (±10°)
Four Multifunction DIO Pins
SPI Interface
-40°C to +85°C Industrial Temperature Range
28-Pin TSSOP Lead(Pb)-Free Package
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to
www.maximintegrated.com/MAX71020.related.
Typical Operating Circuit
NEUTRAL
CT
LOAD
LINE
SHUNT
NOTE:
THIS SYSTEM IS REFERENCED TO LINE VOLTAGE
NEUTRAL
LINE
RESISTOR-
DIVIDER
POWER SUPPLY
LINE
MUX AND ADC
IAP
IAN
VA
VB
IBP
IBN
V
REF
V
3P3A
V
3P3SYS
GNDA
GNDD
MAX71020
REGULATOR
TEMPERATURE SENSOR
COMPUTE ENGINE
POWER-FAULT
COMPARATOR
DIO, PULSES
HOST
SPI
INTERFACE
XOUT
OSCILLATOR/PLL
XIN
9.8304MHz
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
19-6400; Rev 1; 1/13
MAX71020
Single-Chip Electricity Meter AFE
ABSOLUTE MAXIMUM RATINGS
(All voltages with respect to GNDA.)
Voltage and Current Supplies and Ground Pins
V3P3SYS, V3P3A ..................................................-0.5V to +4.6V
GNDD ...................................................................-0.1V to +0.1V
Analog Input Pins
IAP, IAN, IBP, IBN, VA, VB ............................(-10mA to +10mA),
(-0.5V to +0.5V)
XIN, XOUT ......................... (-10mA to +10mA), (-0.5V to +3.0V)
Digital Pins
Inputs.................................... (-10mA to +10mA), (-0.5V to +6V)
Outputs ............ (-10mA to +10mA), (-0.5V to (V
3P3SYS
+ 0.5V))
Temperature and ESD Stress
Operating Junction Temperature (peak, 100ms).............. 140°C
Operating Junction Temperature (continuous) ................. 125°C
Storage Temperature Range............................ -45°C to +165°C
ESD Stress on All Pins ..............................................±4kV, HBM
Lead Temperature (soldering, 10s) .................................. 300°C
Soldering Temperature (reflow) ......................................+250°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........78°C/W
Junction-to-Case Thermal Resistance (q
JC
) ...............13NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
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