MAX64180
HD H.264 CODEC
Data Sheet
Revision 1.1: 06/04/12
Doc. No: 2001_DS
Confidential
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Maxim Integrated Products
120 San Gabriel Drive
Sunnyvale, CA 94086
United States
408-737-7600
www.maxim-ic.com
Copyright © 2012 Maxim Integrated Products
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. Maxim retains
the right to make changes to its products or specifications to improve performance, reliability or manufacturability. All information in
this document, including descriptions of features, functions, performance, technical specifications and availability, is subject to
change without notice at any time. While the information furnished herein is held to be accurate and reliable, no responsibility will be
assumed by Maxim for its use. Furthermore, the information contained herein does not convey to the purchaser of microelectronic
devices any license under the patent right of any manufacturer.
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is a registered trademark of Maxim Integrated Products, Inc.
All other products or service names used in this publication are for identification purposes only, and may be trademarks or registered
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respective holders.
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MAX64180 Data Sheet
Contents
Contents
Revision History........................................................................................................... 13
1
Introduction ....................................................................................................... 15
1.1
1.2
1.3
1.4
Features ........................................................................................................................... 16
Applications ...................................................................................................................... 16
Additional Documentation................................................................................................. 16
Trademark Information ..................................................................................................... 17
2
General Description .......................................................................................... 19
2.1
2.2
Features ........................................................................................................................... 20
General Overview ............................................................................................................. 22
2.2.1 Video I/O Ports .................................................................................................... 22
2.2.2 Video Input Processor ......................................................................................... 22
2.2.3 Video Output Processor....................................................................................... 22
2.2.4 Video and Audio Multimedia Engines .................................................................. 23
2.2.5 Audio Interface..................................................................................................... 23
2.2.6 Memory Interface................................................................................................. 23
2.2.7 ARM Processor.................................................................................................... 23
2.2.8 AES and SHA Hardware Acceleration.................................................................24
Peripheral Interfaces ........................................................................................................ 24
2.3.1 USB 2.0 Interface ................................................................................................ 24
2.3.2 Serial Interfaces................................................................................................... 24
2.3
3
Functional Description ..................................................................................... 25
3.1
Video Subsystem.............................................................................................................. 26
3.1.1 Video Ports .......................................................................................................... 27
3.1.2 Video Control Signals .......................................................................................... 28
3.1.3 Video Clocks........................................................................................................ 29
3.1.4 Video I/O Power Domains ................................................................................... 29
3.1.5 Video Input Processor (VIP) ................................................................................ 30
3.1.6 Video Output Processor (VOP)............................................................................ 32
Audio Subsystem.............................................................................................................. 33
3.2.1 Audio Group Signals............................................................................................ 33
3.2.2 Audio Clocks........................................................................................................ 33
Encoder Subsystem ......................................................................................................... 34
Host Interface ................................................................................................................... 35
3.4.1 Host Interface Connections ................................................................................. 35
3.4.2 Host Interface Signals.......................................................................................... 36
Memory Interface.............................................................................................................. 37
3.5.1 DDR2 SDRAM Connections ................................................................................ 37
Serial Interfaces................................................................................................................ 38
3.6.1 UART Interface .................................................................................................... 38
3.6.2 Two-Wire (TWI) Interface..................................................................................... 39
3.6.3 SPI Interface ........................................................................................................ 39
3.6.4 Pulse Width Modulators....................................................................................... 40
3.6.4.1 Serial I/O Pad Programmable Features................................................. 40
3.2
3.3
3.4
3.5
3.6
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3.7
3.8
3.9
3.10
3.11
3.12
USB 2.0 High-Speed Interface ......................................................................................... 41
3.7.1 Physical Layer (PHY)........................................................................................... 42
3.7.2 USB Controller..................................................................................................... 44
High-Speed Bitstream....................................................................................................... 47
3.8.1 Bitstream Signals................................................................................................. 48
3.8.2 Bitstream Mode.................................................................................................... 48
3.8.3 Clock Plus Enable Mode...................................................................................... 49
Reset Logic...................................................................................................................... 50
3.9.1 Power-On Reset .................................................................................................. 50
3.9.2 Watchdog Reset .................................................................................................. 50
3.9.3 Software Chip Reset............................................................................................ 50
3.9.4 Reset Timing........................................................................................................ 51
Clocks and Phase Lock Loops (PLLs).............................................................................. 52
3.10.1 Clock and PLL inputs........................................................................................... 52
3.10.2 Phase Lock Loops ............................................................................................... 53
3.10.3 Video and Audio Clocks....................................................................................... 53
3.10.3.1 Video Input Clocks............................................................................... 54
3.10.3.2 Video Output Clocks ............................................................................ 54
3.10.3.3 Audio Clocks........................................................................................ 54
Device Configuration ........................................................................................................ 55
3.11.1 Reset ................................................................................................................... 55
3.11.2 Boot Mode for the MMEs and the ARM ............................................................... 55
3.11.3 API Configuration................................................................................................. 56
3.11.4 Pin Muxing ...........................................................................................................56
3.11.5 Debug Mode ........................................................................................................ 56
Oscillator Connections...................................................................................................... 56
3.12.1 Crystal Connected to USB_XIN and USB_XO Pins ............................................ 56
3.12.2 Crystal and External Clock Connected to External CLK_IN Pin .......................... 57
4
Power Supply Considerations ......................................................................... 59
4.1
4.2
Power Supply Sequencing ............................................................................................... 59
Power Supply ................................................................................................................... 60
5
Electrical Specifications................................................................................... 61
5.1
5.2
5.3
Operating Parameters ...................................................................................................... 61
DC Characteristics............................................................................................................ 62
AC Timing ......................................................................................................................... 63
5.3.1 Video Interface AC Timing ................................................................................... 64
5.3.2 Audio Interface AC Timing ................................................................................... 66
5.3.3 Host Interface AC Timing
68
5.3.4 DDR2 SDRAM Interface AC Timing .................................................................... 72
5.3.5 SPI/Bitstream Interface AC Timing ...................................................................... 72
6
Pin Definitions ................................................................................................... 81
6.1
6.2
6.3
6.4
MAX64180 Pin Configuration—248-Pin CTBGA .............................................................. 81
Signal Definitions .............................................................................................................. 86
Pin Identifications ............................................................................................................. 87
Pin Muxing ........................................................................................................................ 88
6.4.1 Audio Signal Group..............................................................................................90
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6.5
6.4.2 Video Port 0 Signal Group ................................................................................... 91
6.4.3 Video Port 2 Signal Group ................................................................................... 92
6.4.4 Host Signal Group ............................................................................................... 93
6.4.5 DDR2 SDRAM Signal Group ............................................................................... 94
6.4.6 USB Signal Group ............................................................................................... 96
6.4.7 UART Signal Group ............................................................................................. 96
6.4.8 SPI/Bitstream Signal Group................................................................................. 97
6.4.9 TWI Signal Group ................................................................................................ 97
6.4.10 PWM Signal Group ..............................................................................................98
6.4.11 GPIO Signal Group..............................................................................................98
6.4.12 JTAG Signal Group............................................................................................100
6.4.13 Configuration .....................................................................................................100
6.4.14 Clock..................................................................................................................101
6.4.15 Reset .................................................................................................................101
6.4.16 Power and Ground Pins.....................................................................................102
Pin List by Power Group .................................................................................................105
6.5.1
Hookup Recommendations when Interfaces are Unused ................................106
7
Package Information........................................................................................ 111
7.1
7.2
7.3
7.4
Package Outline—248-Pin CTBGA, 10mm × 10mm...................................................... 112
Package Diagram ........................................................................................................... 112
Thermal Data .................................................................................................................. 113
7.3.1 Thermal Resistance........................................................................................... 113
Marking ........................................................................................................................... 114
8
Ordering Information .......................................................................................115
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