(DACs) include output buffers and an internal reference
that is selectable to be 2.048V, 2.500V, or 4.096V. The
MAX5713/MAX5714/MAX5715 accept a wide supply
voltage range of 2.7V to 5.5V with extremely low power
(3mW) consumption to accommodate most low-voltage
applications. A precision external reference input allows
rail-to-rail operation and presents a 100kI (typ) load to
an external reference.
The MAX5713/MAX5714/MAX5715 have a 50MHz 3-wire
SPI/QSPI™/MICROWIRE®/DSP-compatible serial interface
that also includes a
RDY
output for daisy-chain applica-
tions. The DAC output is buffered and has a low supply
current of less than 250FA per channel and a low off-
set error of
Q0.5mV
(typ). On power-up, the MAX5713/
MAX5714/MAX5715 reset the DAC outputs to zero, pro-
viding additional safety for applications that drive valves
or other transducers which need to be off on power-up.
The internal reference is initially powered down to allow
use of an external reference. The MAX5713/MAX5714/
MAX5715 allow simultaneous output updates using soft-
ware LOAD commands or the hardware load DAC logic
input (LDAC).
A clear logic input (CLR) allows the contents of the CODE
and the DAC registers to be cleared asynchronously and
sets the DAC outputs to zero. The MAX5713/MAX5714/
MAX5715 are available in a 14-pin TSSOP and an ultra-
small, 12-bump WLP package and are specified over the
-40NC to +125NC temperature range.
Benefits and Features
S
Four High-Accuracy DAC Channels
12-Bit Accuracy Without Adjustment
LSB INL Buffered Voltage Output
±1
Monotonic Over All Operating Conditions
Independent Mode Settings for Each DAC
S
Three Precision Selectable Internal References
2.048V, 2.500V, or 4.096V
S
Internal Output Buffer
Rail-to-Rail Operation with External Reference
4.5µs Settling Time
Outputs Directly Drive 2kI Loads
S
Small 5mm x 4.4mm 14-Pin TSSOP or Ultra-Small
1.6mm x 2.2mm 12-Bump WLP Package
S
Wide 2.7V to 5.5V Supply Range
S
Separate 1.8V to 5.5V V
DDIO
Power-Supply Input
S
50MHz 3-Wire SPI/QSPI/MICROWIRE/DSP
Compatible Serial Interface with
RDY
Output
S
Power-On-Reset to Zero-Scale DAC Output
S
LDAC
and
CLR
For Asynchronous Control
S
Three Software-Selectable Power-Down Output
Impedances
1kI, 100kI, or High Impedance
Functional Diagram
V
DDIO
V
DD
REF
Applications
Programmable Voltage and Current Sources
Gain and Offset Adjustment
Automatic Tuning and Optical Control
Power Amplifier Control and Biasing
Process Control and Servo Loops
Portable Instrumentation
Data Acquisition
INTERNAL REFERENCE/
EXTERNAL BUFFER
CSB
SCLK
DIN
(RDY)
SPI SERIAL
INTERFACE
CODE
REGISTER
DAC
LATCH
8 -/10-/12-BIT
DAC
MAX5713
MAX5714
MAX5715
1 OF 4 DAC CHANNELS
BUFFER
OUTA
OUTB
OUTC
CLR
CODE
(LDAC)
CLEAR /
RESET
LOAD
CLEAR/
RESET
POWER-DOWN
100kI
1kI
OUTD
DAC CONTROL LOGIC
POR
GND
( ) TSSOP PACKAGE ONLY
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation.
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to:
www.maximintegrated.com/MAX5713.related
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-6394; Rev 3; 6/13
MAX5713/MAX5714/MAX5715
Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered
Output DACs with Internal Reference and SPI Interface
ABSOLUTE MAXIMUM RATINGS
V
DD
, V
DDIO
to GND ................................................ -0.3V to +6V
OUT_, REF to GND ................................. ....-0.3V to the lower of
(V
DD
+ 0.3V) and +6V
CSB, SCLK,
LDAC, CLR
to GND ............................ -0.3V to +6V
DIN,
RDY
to GND ........................................-0.3V to the lower of
(V
DDIO
+ 0.3V) and +6V
Continuous Power Dissipation (T
A
= +70NC)
TSSOP (derate at 10mW/NC above 70NC) ...................797mW
WLP (derate at 16.1mW/NC above 70NC) ..................1288mW
Maximum Continuous Current into Any Pin ....................
Q50mA
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s) ...........+300NC
Soldering Temperature (reflow) .................................... +260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
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