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MAX3395EETC+

产品描述±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry
产品类别模拟混合信号IC    驱动程序和接口   
文件大小2MB,共21页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX3395EETC+概述

±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry

MAX3395EETC+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码QFN
包装说明HVQCCN, LCC12,.16SQ,32
针数12
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time6 weeks
Samacsys DescriptiTranslation - Voltage Levels 15kV ESD-Protected, High-Drive Current, Dual-/Quad-/Octal-Level Translators with Speed-Up Circuitry
差分输出NO
驱动器位数1
输入特性STANDARD
接口集成电路类型LINE TRANSCEIVER
接口标准GENERAL PURPOSE
JESD-30 代码S-XQCC-N12
JESD-609代码e3
长度4 mm
湿度敏感等级1
功能数量1
端子数量12
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装等效代码LCC12,.16SQ,32
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源1.8/5 V
认证状态Not Qualified
最大接收延迟
接收器位数1
座面最大高度0.8 mm
最大供电电压5.5 V
最小供电电压1.65 V
标称供电电压3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式NO LEAD
端子节距0.8 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度4 mm

文档预览

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MAX3394E/MAX3395E/
MAX3396E
±15kV ESD-Protected, High-Drive Current,
Dual-/Quad-/Octal-Level Translators with
Speed-Up Circuitry
Features
General Description
The MAX3394E/MAX3395E/MAX3396E bidirectional level
translators provide level shifting required for data transfer
in a multivoltage system. Internal slew-rate enhancement
circuitry features 10mA current-sink and 15mA current-
source drivers to isolate capacitive loads from lower current
drivers. In open-drain systems, slew-rate enhancement
enables fast data rates with larger pullup resistors and
increased bus load capacitance. Externally applied volt-
ages, V
CC
and V
L
, set the logic-high levels for the device.
A logic-low signal on one I/O side of the device appears as
a logic-low signal on the opposite I/O side, and vice-versa.
Each I/O line is pulled up to V
CC
or V
L
by an internal pullup
resistor, allowing the devices to be driven by either push-
pull or open-drain drivers.
The MAX3394E/MAX3395E/MAX3396E feature a tri-
state output mode, thermal-shutdown protection, and
±15kV Human Body Model (HBM) ESD protection on the
V
CC
side for greater protection in applications that route
signals externally.
The MAX3394E/MAX3395E/MAX3396E accept V
CC
volt-
ages from +1.65V to +5.5V, and V
L
voltages from +1.2V
to V
CC
, making them ideal for data transfer between low
voltage ASIC/PLDs and higher voltage systems. The
MAX3394E/MAX3395E/MAX3396E operate at a guaran-
teed data rate of 6Mbps with push-pull drivers and 1Mbps
with open-drain drivers.
The MAX3394E is a dual-level translator available in
9-bump UCSP™ and 8-pin 3mm x 3mm TDFN packages.
The MAX3395E is a quad-level translator available in
12-bump UCSP, and 12-pin 4mm x 4mm TQFN packag-
es. The MAX3396E is an octal-level translator available in
20-bump UCSP and 20-pin 5mm x 5mm TQFN packages.
The MAX3394E/MAX3395E/MAX3396E operate over the
extended -40°C to +85°C temperature range.
±15kV ESD Protection on I/O V
CC_
Lines
Bidirectional Level Translation Without Direction Pin
I/O V
L_
and I/O V
CC_
10mA Sink-/15mA Source-
Current Capability
Slew-Rate Enhancement Circuitry Supports
Larger Capacitive Loads or Larger External Pullup
Resistors
6Mbps Push-Pull/1Mbps Open-Drain Guaranteed
Data Rate
Wide Supply-Voltage Range: Operation Down to
+1.2V on V
L
and +1.65V on V
CC
Low Supply Current in Tri-State Output Mode
(3μA typ)
Low Quiescent Current
Thermal-Shutdown Protection
UCSP, TDFN, and TQFN Packages
Ordering Information
PART
MAX3394EETA+T
MAX3394EEBL+T
MAX3395EETC+
MAX3395EEBC+T
MAX3396EEBP+T*
MAX3396EETP+*
PIN-PACKAGE
8 TDFN-EP**
9 UCSP
12 TQFN-EP**
12 UCSP
20 UCSP
20 TQFN-EP**
PKG CODE
T833-1
B9-5
T1244-4
B12-1
B20-1
T2055-4
Note:
All devices specified over the -40°C to +85°C operating
range.
+Denotes lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
**EP = Exposed paddle.
Selector Guide appears at end of data sheet.
Applications
Pin Configurations
I/O V
L
1
7
I/O V
L
2
6
3
I/O V
CC
1
V
L
8
*EP
GND
5
4
I/O V
CC
2
Multivoltage Bidirectional Level Translation
SPI™, MICROWIRE™, and I
2
C Level Translation
Open-Drain Rise-Time Speed-Up
High-Speed Bus Fan-Out Expansion
Cell Phones
Telecom, Networking, Servers, RAID/SAN
TOP VIEW
(LEADS ON BOTTOM)
MAX3394E
+
1
V
CC
2
EN
MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet.
*CONNECT EXPOSED PAD TO GROUND
TDFN
19-3884; Rev 3; 7/17

MAX3395EETC+相似产品对比

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