19-6276; Rev 0; 4/12
EVALUATION KIT AVAILABLE
MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
General Description
The MAX14611 is a quad bidirectional logic-level transla-
tor that provides the level shifting necessary to allow data
transfer in a multivoltage system. Externally applied volt-
ages, V
CC
and V
L
, set the logic levels on either side of
the device. A low-voltage logic signal present on the V
L
side of the device appears as a high-voltage logic signal
on the V
CC
side of the device, and vice-versa.
The device is ideal for
bus as well as MDIO bus appli-
cations where open-drain operation is often required. The
device features a three-state output mode (TS). Drive
TS
high to connect the pullup to the powered I/O port. This
allows for continuous, undisrupted I
2
C operation on the
powered side of the device while the level translation
function is off. The MAX14611 is a pin-to-pin compatible
upgrade to the MAX3378E in the TDFN package.
The MAX14611 features enhanced high-electrostatic-
discharge (ESD) protection on all I/OVCC_ ports up to
±6kV HBM. The device operates over the -40NC to +85NC
extended temperature range and is available in 3mm x
3mm, 14-pin TDFN and 4.9mm x 5.1mm, 14-pin TSSOP
packages.
I
2
C
Benefits and Features
S
Improved Interoperability
Meets I
2
C Specifications
10kI Internal Pullup Resistor
Pin-to-Pin Compatible with the MAX3377E and
the MAX3378E
0.9V Operation on Low Voltage Supply
S
Robust Logic-Level Translation
±0.5V
Tolerances on All Pins
±6kV
Human Body Model ESD Protection on
I/OVCC½ Lines
Thermal Short-Circuit Protection
Short to Ground Fault Protection on All Pins
-40NC to +85NC Operating Temperature Range
S
Increased Design Flexibility
Ultra-Low Supply Current
Pullup Resistor Enabled with a Single Power
Supply when
TS
= High
10I (max) Transmission Gate FET
Small, 14-Pin, 3.0mm x 3.0mm TDFN Package
and 14-Pin, 4.9mm x 5.1mm TSSOP Package
Applications
SPI, I
2
C, and MDIO
Level Translation
Low-Voltage ASIC
Level Translation
Portable Electronics
Mobile Phones
POS Systems
Telecommunications
Equipment
Ordering Information
appears at end of data sheet.
Typical Operating Circuit
+1.8V
0.1µF
TS
+1.8V SYSTEM
CONTROLLER
DATA
I/OVL_
V
L
V
CC
1µF
+3.3V
MAX14611
I/OVCC_
DATA
+3.3V
SYSTEM
For related parts and recommended products to use with this part, refer to
www.maxim-ic.com/MAX14611.related.
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Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
CC
..........................................................................-0.5V to +6V
V
L
..........................................................................-0.5V to +5.5V
TS
............................................................................-0.5V to +6V
I/OVCC_.................................................... -0.5V to (V
CC
+ 0.5V)
I/OVL_ .......................................................... -0.5V to (V
L
+ 0.5V)
Short-Circuit Duration I/OVL_, I/OVCC_ to GND .......Continuous
Continuous Current .........................................................
Q50mA
Continuous Power Dissipation (T
A
= +70NC)
TDFN (derate 24.4mW/NC above +70NC) ...............1951.2mW
TSSOP (derate 10mW/NC above +70NC) .................796.8mW
Operating Temperature Range .......................... -40NC to +85NC
Maximum Junction Temperature.....................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) .....................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN-EP
Junction-to-Ambient Thermal Resistance (q
JA
) ...........41°C/W
Junction-to-Case Thermal Resistance (q
JC
)..................8°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) ......100.4°C/W
Junction-to-Case Thermal Resistance (q
JC
)................30°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
CC
= +1.65V to +5.5V, V
L
= 0.9V to the lesser of V
CC
+ 0.3V and 5V. T
A
= T
J
= -40NC to +85NC, unless otherwise noted. Typical
values are at V
CC
= +3.3V, V
L
= +1.8V, T
A
= +25NC, unless otherwise noted.) (Notes 2, 3)
PARAMETER
POWER SUPPLIES
V
L
Supply Range
V
CC
Supply Range
V
L
Supply Current
V
CC
Supply Current
V
CC
Shutdown Mode Supply
Current
V
L
Shutdown Mode Supply
Current
I/OVCC_, I/OVL_,
TS
Leakage
Current
TS
Input Leakage Current
V
L
Shutdown Threshold
V
CC
Shutdown Threshold
I/OVL_ Pullup Resistor
I/OVCC_ Pullup Resistor
V
L
V
CC
I
VL
I
VCC
I
SHDN_VCC
I/OVCC_ = V
CC
, I/OVL_ = V
L
,
TS
= V
L
I/OVCC_ = V
CC
, I/OVL_ = V
L
,
TS
= V
L
TS
= GND, I/OVCC = unconnected
TS
= V
CC
, V
L
= GND,
I/OVCC = unconnected
TS
= GND
I
SHDN_VL
I
LEAK
I
LEAK_TS
V
TH_VL
V
TH_VCC
R
VL_PU
R
VCC_PU
TS
= V
L
, V
CC
= GND,
I/OVL_ = unconnected
T
A
= +25NC,
TS
= GND
T
A
= +25NC
0.3
0.8
10
10
0.1
0.1
0.1
0.1
0.1
0.9
1.65
5
5.5
1
35
1
1
1
1
1
1
0.85
1.35
FA
FA
V
V
FA
FA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
FA
FA
V
V
kI
kI
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Maxim Integrated Products
2
MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +1.65V to +5.5V, V
L
= 0.9V to the lesser of V
CC
+ 0.3V and 5V. T
A
= T
J
= -40NC to +85NC, unless otherwise noted. Typical
values are at V
CC
= +3.3V, V
L
= +1.8V, T
A
= +25NC, unless otherwise noted.) (Notes 2, 3)
PARAMETER
I/OVL_ to I/OVCC_ DC
Resistance
I/OVL_ Input-Voltage High
I/OVL_ Input-Voltage Low
I/OVCC_ Input-Voltage High
I/OVCC_ Input-Voltage Low
I/OVL_ Output-Voltage High
I/OVL_ Output-Voltage Low
I/OVCC_ Output-Voltage High
I/OVCC_ Output Voltage Low
TS
Input-Voltage High Threshold
TS
Input-Voltage Low Threshold
Accelerator Pulse Duration
V
L
Output Accelerator Source
Impedance
V
CC
Output Accelerator Source
Impedance
Thermal-Shutdown Threshold
ESD PROTECTION
I/OVCC_
All Other Pins
Human Body Model, C
VCC
= 1FF,
C
VL
= 0.1FF
Human Body Model
Q6
Q2
kV
kV
SYMBOL
R
IOVL_IOVCC
V
IHL
V
ILL
V
IHC
V
ILC
V
OHL
V
OLL
V
OHC
V
OLC
V
IH
V
IL
V
L
> 1.3V
Inferred from timing measurements
V
L
= 0.9V
V
L
= 3.3V
V
CC
= 1.65V
V
CC
= 5.0V
20NC hysteresis
70
15
50
10
+150
I/OVL_ source current = 10FA
I/OVL_ sink current = 2mA,
V
I/OVCC_
P
50mV
I/OVCC_ source current = 10FA
I/OVCC_ sink current = 2mA,
V
I/OVL_
P
150mV
V
L
- 0.2
0.2
30
0.7 x V
CC
0.4
0.7 x V
L
0.4
V
CC
- 0.4
0.2
CONDITIONS
Inferred from V
OL
measurements
V
L
- 0.2
0.15
MIN
TYP
5
MAX
10
UNITS
I
V
V
V
V
V
V
V
V
V
V
ns
I
I
NC
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Maxim Integrated Products
3
MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
TIMING CHARACTERISTICS
(V
CC
= +1.65V to +5.5V, V
L
= +0.9V to the lesser of V
CC
+ 0.3V and 5V,
TS
= V
L
, R
L
= 1Mω, C
VCC
= 1µF, C
VL
= 0.1µF, C
I/OVCC_
= 15pF,
C
I/OVL_
= 15pF, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are V
CC
= +3.3V, V
L
= +1.8V, and T
A
= +25NC.) (Note 4)
PARAMETER
I/OVCC_ Rise Time
I/OVCC_ Fall Time
I/OVL_ Rise Time
I/OVL_ Fall Time
Propagation Delay
Propagation Delay
SYMBOL
t
RVCC
t
FVCC
t
RVL
t
FVL
I/O
VL-VCC
I/O
VL-VCC
I/O
VCC-VL
I/O
VCC-VL
CONDITIONS
Push-pull driving (Figure 1)
Open-drain driving (Figure 2, Note 5)
Push-pull driving (Figure 1)
Open-drain driving (Figure 2, Note 5)
Push-pull driving (Figure 3)
Open-drain driving (Figure 4, Note 5)
Push-pull driving (Figure 3)
Open-drain driving (Figure 4, Note 5)
Push-pull driving (Figure 1)
Open-drain driving (Figure 2, Note 5)
Push-pull driving (Figure 3)
Open-drain driving (Figure 4, Note 5)
Input rise time/fall time < 6ns, push-pull
driving
Input rise time/fall time < 6ns, open-drain
driving
Push-pull operation
Open-drain operation (Notes 5, 6)
MIN
TYP
MAX
40
100
40
50
30
105
30
30
40
150
30
105
20
ns
50
20
6
Mbps
UNITS
ns
ns
ns
ns
ns
ns
Channel-to-Channel Skew
t
SKEW
Maximum Data Rate
Note 2:
All units are 100% production tested at T
A
= +25°C. Specifications over operating temperature range are guaranteed by
design.
Note 3:
V
L
must be less than or equal to V
CC
during normal operation. However, V
L
can be greater than V
CC
during startup and
shutdown conditions.
Note 4:
All timing is 10% to 90% for rise time and 90% to 10% for fall time.
Note 5:
Not production tested; guaranteed by design.
Note 6:
Requires the external pullup resistor.
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Maxim Integrated Products
4
MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
t
RVCC
t
FVCC
90%
V
L
V
CC
90%
V
L
R
S
50
I
TS
V
CC
MAX14611
I/OVL_
GND
I/OVCC_
C
I/OVCC_
R
L
50%
10%
t
PDLH
50%
50%
50%
10%
t
PDHL
Figure 1. Push-Pull Driving I/OVL_
V
L
V
CC
t
RVCC
t
FVCC
90%
90%
V
L
1k
I
TS
V
CC
1k
I
MAX14611
I/OVL_
GND
I/OVCC_
C
I/OVCC_
R
L
50%
10%
t
PDLH
t
PDHL
50%
50%
50%
10%
Figure 2. Open-Drain Driving I/OVL_
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Maxim Integrated Products
5
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