19-4117; Rev 1; 4/09
KIT
ATION
EVALU
BLE
AVAILA
Hi-Speed USB-to-SD Card
Readers with Bypass
General Description
Features
♦
USB 2.0 Hi-Speed and Full-Speed Compliant
♦
SDHC Card Support
♦
Internal Hi-Speed USB SD Card Reader Eases
Host µP Overhead
♦
On-Chip Termination and Pullup Resistors
♦
Internal SD Switches Allow For Multiplexing Two
SD Cards on a Single-Microprocessor SD Port
♦
Accommodates Clock Input Frequencies
26MHz, 19.2MHz, 13MHz, and 12MHz
♦
Internal Clock Squarer for Low-Amplitude TCXO
Signals
♦
No Power-Supply Sequencing Required
♦
Compatible with +1.8V to +3.3V I/O Host
Microprocessor
♦
Simple Control Mode Requires Only a Single
GPIO
♦
I
2
C Control Provides Multiple Configuration
Options
♦
I
2
C Control Required for Two SD Cards
♦
On-Chip Power-On Reset/Brown-Out Reset
MAX14500–MAX14503
The MAX14500–MAX14503 USB-to-SD™ card readers
provide a means for portable devices that support full-
speed USB communication (12Mbps) with one or two
SD card slots, upgrading the USB SD card reader func-
tion to USB Hi-Speed (480Mbps) operation. The
MAX14500–MAX14503 have two modes of operation:
Pass Thru and Card Reader. In pass thru, the SD and
USB signals pass through the MAX14500–MAX14503
without modification, appearing like the device is not
present. The host microprocessor firmware does not
need modification, as there is no change from the host
microprocessor’s perspective. In Card Reader mode,
the MAX14500–MAX14503 implement a Hi-Speed USB
card reader that operates independently of the host
microprocessor. All the capabilities of the full-speed
USB port and SD card slot are preserved with the addi-
tional feature that allows a faster way for a PC to read or
write to the SD card. The MAX14500–MAX14503 sup-
port SD high capacity SDHC cards. The 40-pin TQFN
version supports one SD card, while the 56-bump WLP
version supports two SD cards.
The MAX14500–MAX14503 feature advanced power-
saving modes to reduce power consumption in
portable applications. The low-power Sleep modes
allow the ability to disable internal circuit blocks, pro-
viding power-saving operating modes. The default
clock input for each part number is specified in the
ordering information. The MAX14500–MAX14503 fea-
ture the option to change the default values using the
I
2
C interface.
The MAX14500–MAX14503 are available in 5mm x
5mm, 40-pin TQFN, and 3.23mm x 3.5mm, 56-bump
WLP packages. These devices operate over a wide
supply voltage range and are specified over the -40°C
to +85°C extended temperature range.
Ordering Information/
Selector Guide
PART
MAX14500ETL+*
MAX14500AEWN+*
MAX14501ETL+*
MAX14501AEWN+*
MAX14502AETL+
MAX14502AEWN+*
MAX14503ETL+*
MAX14503AEWN+*
INPUT
SD
FREQUENCY
CARDS
(MHz)
12
12
13
13
19.2
19.2
26
26
1
2
1
2
1
2
1
2
PIN-
PACKAGE
40 TQFN-EP**
56 WLP
40 TQFN-EP**
56 WLP
40 TQFN-EP**
56 WLP
40 TQFN-EP**
56 WLP
Applications
Cell Phones
PDAs
MP3 Players
Digital Still Cameras
GPS
Note:
All devices are specified over the -40°C to +85°C oper-
ating temperature range.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*Future
product—contact factory for availability.
**EP
= Exposed pad.
SD is a trademark of the SD Card Association.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Hi-Speed USB-to-SD Card
Readers with Bypass
MAX14500–MAX14503
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
CC
...........................................................................-0.3V to +4V
V
SD
...........................................................................-0.3V to +4V
V
IO
............................................................................-0.3V to +4V
V
TM
...........................................................................-0.3V to +4V
KVBUS......................................................................-0.3V to +4V
CLDO........................................................................-0.3V to +2V
CDAT1_[3:0], HDAT1_[3:0], CCMD1, HCMD1, CCLK1, HCLK1,
CCRD_PRST, HCRD_PRST, CDAT2_[3:0], HDAT2_[3:0],
CCMD2, HCMD2, CCLK2, HCLK2 .........-0.3V to (V
SD
+ 0.3V)
BUSY, BERR/INT,
MODE, SCL, SDA, I2C_SEL,
ADD,
RST.................................................-0.3V
to (V
IO
+ 0.3V)
CD+, CD-, HD+, HD-, RREF, FREF ............-0.3V to (V
TM
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
40-Pin TQFN (derate 35.7mW/°C above +70°C) ........2857mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1)
40-Pin TQFN ................................................................1.7°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)
40-Pin TQFN .................................................................28°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Pass thru
V
CC
Supply Voltage
V
CC
Card reader active, f
CCLK_
≤
26MHz
Card reader active, f
CCLK_
> 26MHz
Pass thru
V
SD
Supply Voltage
Logic Interface Supply Voltage
USB Supply Voltage
Digital Core LDO Regulator
Output Voltage
V
CC
Supply Current
V
SD
Supply Current
V
IO
Supply Current
V
TM
Supply Current
V
SD
Comparator Threshold
V
TM
Comparator Threshold
MODE, I2C_SEL, ADD,
RST
Input-Voltage Low
V
SD
V
IO
V
TM
V
CLDO
I
CC
I
SD
I
IO
I
TM
V
SDCT
V
TMCT
V
IL
C
CLDO
= 1.0µF
Pass thru
Card reader active
Pass thru
Card reader active
Pass thru
Card reader active
Pass thru
Card reader active
1.0
2.0
Card reader active, f
CCLK_
≤
26MHz
Card reader active, f
CCLK_
> 26MHz
2.1
2.1
2.4
2.0
2.0
2.4
1.5
2.91
1.8
5
35
17
3
2
0.2
13
25
1.5
2.5
1.9
2.9
0.4
50
10
15
50
40
3.6
3.6
3.6
3.6
3.6
3.6
3.6
3.4
V
V
V
µA
mA
µA
mA
µA
mA
µA
mA
V
V
V
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2
_______________________________________________________________________________________
Hi-Speed USB-to-SD Card
Readers with Bypass
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
MODE, I2C_SEL, ADD,
RST
Input-Voltage High
BUSY, BERR/INT
Output-Voltage Low
BUSY, BERR/INT
Output-Voltage High
I2C_SEL, ADD,
RST
Input
Leakage Current
MODE Input Resistance to GND
FREF Full-Swing Input-Voltage
High
FREF Full-Swing Input-Voltage
Low
FREF Low-Amplitude Input-
Voltage Low
FREF Input Leakage Current
FREF Input Resistance
KVBUS Comparator Threshold
KVBUS Comparator Hysteresis
KVBUS Comparator Input
Impedance
SDA/SCL Input Low Voltage
SDA/SCL Input High Voltage
V
TH
V
HYS
R
IN
V
IL_I2C
V
IH_I2C
V
IO
> +2V, 3mA sink current
SDA Output Logic-Low
SDA/SCL Input Leakage Current
SD CARD INTERFACE
On-Resistance
Off-Leakage Current
Off-Capacitance
On-Capacitance
Pullup Resistance
Output High Voltage
Output Low Voltage
R
ON
I
ILSD
C
SD_OFF
C
SD_ON
R
PU
V
OH
V
OL
V
TEST
= 0 or V
SD
, I
TEST
= 10mA (Note 3)
V
TEST
= 0 or V
SD
(Note 3)
(Note 4)
(Note 5)
CCMD1, CCMD2, CDAT1_[3:0],
CDAT2_[3:0]
I
OH
= -100µA
I
OL
= 100µA
50
0.75 x
V
SD
0.125 x
V
SD
-1
5
10
75
100
10
+1
Ω
µA
pF
pF
kΩ
V
V
V
OL_I2C
I
IN_I2C
V
IO
≤
+2V, 3mA sink current
0.7 x
V
IO
0
0
-10
0.4
0.2 x
V
IO
+10
V
µA
10
0.3 x
V
IO
SYMBOL
V
IH
V
OL
V
OH
I
IL
R
MODE
V
IH
V
IL
V
IL
I
ILF
Full-Swing mode
Low-Amplitude input mode
1.0
200
-10
1
1.25
20
1.5
+10
I
LOAD
= 1mA
I
LOAD
= -1mA
V
IO
-
0.4
-1
150
1.3
0.4
300
+1
500
CONDITIONS
MIN
2/3 x
V
IO
0.4
TYP
MAX
UNITS
V
V
V
µA
kΩ
V
V
mV
µA
MΩ
V
mV
MΩ
V
V
MAX14500–MAX14503
_______________________________________________________________________________________
3
Hi-Speed USB-to-SD Card
Readers with Bypass
MAX14500–MAX14503
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
V
SD
< 2.4V
Input High Voltage
V
IH
V
SD
≥
2.4V
V
SD
< 2.4V
Input Low Voltage
V
IL
V
SD
≥
2.4V
USB INTERFACE
On-Resistance
On-Resistance Flatness
On-Capacitance
Off-Capacitance
AC CHARACTERISTICS (Note 6)
SD CARD CLOCK TIMING (CCLK_), DEFAULT SPEED (Figure 5a)
Clock Low Time
Clock High Time
Clock Rise Time
Clock Fall Time
Clock Low Time
Clock High Time
Clock Rise Time
t
WL
t
WH
t
TLH
t
THL
t
WL
t
WH
t
TLH
C
L
= 10pF
C
L
= 10pF
C
L
= 10pF
C
L
= 10pF
C
L
= 40pF
C
L
= 40pF
C
L
= 40pF
7
7
3
3
5
2
14
2.5
400
5
250
0.6
19
19
10
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
kHz
pF
ns
µs
R
ON
R
ONFLAT
C
ON_USB
C
OFF_USB
V
CD_
= 0 or V
TM
, switch closed
V
CD_
= 0 to 3.3V, V
TM
= +3.3V
Switch closed, measured from CD+ and
CD-
Switch open, measured from CD+, CD-,
HD+, HD-
5
2
12
6
Ω
Ω
pF
pF
CONDITIONS
MIN
0.8 x
V
SD
0.625 x
V
SD
0.2 x
V
SD
0.25 x
V
SD
V
TYP
MAX
UNITS
V
SD CARD CLOCK TIMING (CCLK_), HI-SPEED (Figure 5b)
Clock Fall Time
t
THL
C
L
= 40pF
SD CARD COMMAND TIMING (CCMD1, CCMD2) (Figure 5b)
Input Setup Time
t
ISU
Input Hold Time
Output Delay Time During Data
Transfer Mode
Output Hold Time
I
2
C CHARACTERISTICS
SCL Clock Frequency
SDA, SCL Capacitance
SDA Output Fall Time
Hold Time After Repeated START
f
SCL
C
IO_I2C
t
OF_I2C
t
HD,STA
t
IH
t
ODLY
t
OH
4
_______________________________________________________________________________________
Hi-Speed USB-to-SD Card
Readers with Bypass
MAX14500–MAX14503
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
Clock Low Period
Clock High Period
Setup Time for Repeated START
Hold Time for Data
Setup Time for Data
SDA/SCL Input Fall Time
SDA/SCL Rise Time
Setup Time for STOP
Bus Free Time Between STOP
and START
SYMBOL
t
LOW_I2C
t
HIGH_I2C
t
SU,STA
t
HD,DAT
t
SU,DAT
t
F_I2C
t
R_I2C
t
SU,STO
t
BUF
0.6
1.3
100
300
300
CONDITIONS
MIN
1.3
0.6
0.6
0
0.9
TYP
MAX
UNITS
µs
µs
µs
µs
ns
ns
ns
µs
µs
USB HI-SPEED SOURCE ELECTRICAL CHARACTERISTICS
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Hi-Speed Squelch Detection
Threshold (Diff Signal Amplitude)
Hi-Speed Differential Input
Signaling Levels
Hi-Speed Data Signaling
Common-Mode Voltage Range
Hi-Speed Idle Level
Hi-Speed Data Signaling High
Hi-Speed Data Signaling Low
Chirp J Level (Differential
Voltage)
Chirp K Level (Differential
Voltage)
Termination Voltage (Hi-Speed)
AC CHARACTERISTICS
Rise Time
Fall Time
Driver Waveform Requirements
Driver-Output Resistance
Source Jitter Total (Including
Frequency Tolerance)
Z
HSDRV
Specified by Hi-Speed transmit eye diagram
t
HSR
t
HSF
(Note 6)
(Note 6)
Specified by Hi-Speed transmit eye diagram
500
500
See the
Typical Operating
Characteristics
section
40.5
49.5
Ω
ps
ps
V
HSSQ
V
IL
SCM
V
HSOI
V
HSOH
V
HSOL
V
CHIRPJ
V
CHIRPK
V
HSTERM
(Note 6)
Specified by Hi-Speed receive eye diagram
(Note 6)
-50
-10
360
-10
700
-900
-10
+500
+10
440
+10
1100
-500
+10
mV
mV
mV
mV
mV
mV
mV
100
150
mV
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
See the
Typical Operating
Characteristics
section
_______________________________________________________________________________________
5
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