MAX1308_EC_ _ .................................................0°C to +75°C
MAX1308_EE_ _ ..............................................-40°C to +85°C
MAX1308_EA_ _ ............................................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.) (Note 1)
PARAMETER
DRIVER
V
CC
Supply-Voltage Range
Differential Driver Output
Change in Magnitude of
Differential Output Voltage
Driver Common-Mode Output
Voltage
Change in Magnitude of
Common-Mode Voltage
Input-High Voltage
Input-Low Voltage
Input Hysteresis
Input Current
Input Impedance First Transition
Input Current
SRL Input-High Voltage
SRL Input-Middle Voltage
SRL Input-Low Voltage
SRL Input Current
Output Leakage (Y and Z)
Full Duplex
I
O
SRL = V
CC
SRL = GND
DE = GND,
V
CC
= GND or V
CC
V
IN
= +12V
V
IN
= -7V
-100
-75
125
I
IN2
V
CC
R
L
= 100Ω (RS-422), Figure 1
V
OD
R
L
= 54Ω (RS-485), Figure 1
No load
ΔV
OD
V
OC
ΔV
OC
V
IH
V
IL
V
HYS
I
IN1
R
L
= 100Ω or 54Ω, Figure 1 (Note 2)
R
L
= 100Ω or 54Ω, Figure 1
R
L
= 100Ω or 54Ω, Figure 1 (Note 2)
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE
DE
TXP, RXP, H/F internal pulldown
1
10
V
CC
- 0.4
V
CC
x 0.3
V
CC
x 0.7
0.4
75
100
±1
10
40
3
0.8
V
CC
/ 2
4.5
3
2
5.5
V
CC
V
CC
V
CC
0.2
3
0.2
V
V
V
V
V
mV
µA
kΩ
µA
V
V
V
µA
µA
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2
Maxim Integrated
MAX13080E–MAX13084E/
MAX13086E–MAX13089E
+5.0V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
0
≤
V
OUT
≤
+12V (Note 3)
-7V
≤
V
OUT
≤
V
CC
(Note 3)
Driver Short-Circuit Output
Current
I
OSD
0
≤
V
OUT
≤
+12V, +85°C
≤
T
A
≤
+125°C
(Note 3)
-7V
≤
V
OUT
≤
V
CC
, +85°C
≤
T
A
≤
+125°C
(Note 3)
Driver Short-Circuit Foldback
Output Current
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
Input Current (A and B)
RECEIVER
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
RO Output-High Voltage
RO Output-Low Voltage
Three-State Output Current at
Receiver
Receiver Input Resistance
Receiver Output Short-Circuit
Current
SUPPLY CURRENT
No load,
RE
= 0, DE = V
CC
Supply Current
Supply Current in Shutdown
Mode
ESD PROTECTION
Human Body Model
ESD Protection for Y, Z, A, and B
Contact Discharge
IEC 61000-4-2
±15
±6
kV
kV
I
CC
No load,
RE
= V
CC
, DE = V
CC
No load,
RE
= 0, DE = 0
I
SHDN
RE
= V
CC
, DE = GND
1.2
1.2
1.2
2.8
1.8
1.8
1.8
10
µA
mA
V
TH
ΔV
TH
V
OH
V
OL
I
OZR
R
IN
I
OSR
-7V
≤
V
CM
≤
+12V
V
A
+ V
B
= 0V
I
O
= -1mA
I
O
= 1mA
0
≤
V
O
≤
V
CC
-7V
≤
V
CM
≤
+12V
0V
≤
V
RO
≤
V
CC
96
±110
V
CC
- 0.6
0.4
±
1
-200
-125
15
-50
mV
mV
V
V
µA
kΩ
mA
I
OSDF
T
TS
T
TSH
I
A, B
DE = GND,
V
CC
= GND or V
CC
V
IN
= +12V
V
IN
= -7V
-100
(V
CC
- 1V)
≤
V
OUT
≤
+12V (Note 3)
-7V
≤
V
OUT
≤
+1V (Note 3)
175
15
125
MIN
40
-250
40
-270
20
-20
TYP
MAX
250
-40
270
-40
mA
°C
°C
µA
mA
UNITS
Maxim Integrated
3
MAX13080E–MAX13084E/
MAX13086E–MAX13089E
+5.0V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.)
PARAMETER
Driver Propagation Delay
Driver Differential Output Rise or
Fall Time
Differential Driver Output Skew
|t
DPLH
- t
DPHL
|
Maximum Data Rate
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
Driver Enable from Shutdown to
Output High
Driver Enable from Shutdown to
Output Low
Time to Shutdown
t
DZH
t
DZL
t
DLZ
t
DHZ
Figure 4
Figure 5
Figure 5
Figure 4
SYMBOL
t
DPLH
t
DPHL
t
R ,
t
F
t
DSKEW
CONDITIONS
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
250
2500
2500
100
100
5500
5500
50
340
700
MIN
350
350
400
TYP
MAX
1800
1800
1900
250
UNITS
ns
ns
ns
kbps
ns
ns
ns
ns
ns
ns
ns
t
DZH(SHDN)
Figure 4
t
DZL(SHDN)
Figure 5
t
SHDN
RECEIVER SWITCHING CHARACTERISTICS
MAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)
ABI Research最近评选并公布了全球超高频无源和高频无源 RFID芯片的前十大制造商。 前十大超高频无源芯片制造商是： 前十大高频无源芯片制造商是： 超高频的得奖名单并不出人意外，因为实际上似乎总是前三家公司获得大订单。ABI分析家 Mike Liard称，ABI很容易就评选出 Alien、Avery,和 Raflatac为全球...[详细]
2008年7月9日，欧司朗光电半导体率先推出发光二极管光线数据文件的互联网访问平台，是全球第一家提供该类互联网资源的 LED 制造商。这些光线文件不仅描述 LED 光线的发射模式，而且还包含发射点坐标、发射方向、光线强度和波长等信息。欧司朗的互联网信息资源涵盖包括红外发光二极管 (IRED) 在内的几乎所有 LED 产品组合。透过这平台，客户们不论白天或黑夜，随时都可以获取最新的数据，这无疑为他...[详细]
Yamaha Motor Group旗下的i-PULSE有限公司日前已与华尔莱科技（Valor）结为合作伙伴关系，基于Valor的vPlan生产规划工具向i-PULSE组装设备的使用者提供完整的从设计到制造的NPI解决方案。在近期日本东京举办的Protec展会（6/11-6/13）上，i-PULSE首度展出了该新产品并将直接向其客户进行销售。 新产品的名称为“iPlan”，它将提供一系...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
