电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89H34H16G2ZBBLGI

产品描述PCI Bus Controller, PBGA1156
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小184KB,共3页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

89H34H16G2ZBBLGI概述

PCI Bus Controller, PBGA1156

89H34H16G2ZBBLGI规格参数

参数名称属性值
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
包装说明BGA, BGA1156,34X34,40
Reach Compliance Codecompliant
ECCN代码3A001.A.3
地址总线宽度
总线兼容性I2C; ISA; PCI; SMBUS; VGA
最大时钟频率125 MHz
最大数据传输速率34000 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B1156
长度35 mm
端子数量1156
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA1156,34X34,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)NOT SPECIFIED
电源1,2.5,2.5/3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大压摆率6264 mA
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度35 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档预览

下载PDF文档
34-Lane 16-Port PCIe® Gen2
System Interconnect Switch
®
89HPES34H16G2
Product Brief
The 89HPES34H16G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES34H16G2 is a 34-lane, 16-
port peripheral chip that performs PCI Express packet switching with a
feature set optimized for high-performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and up to
fifteen downstream ports and supports switching between downstream
ports.
Utilizing standard PCI Express Gen2 interconnect, the PES34H16G2
provides the most efficient system interconnect switching solution for
applications requiring high throughput, low latency, and simple board
layout with a minimum number of board layers. Each lane is capable of 5
GT/s of bandwidth in both directions and is fully compliant with PCI
Express Base specification 2.0.
Device Overview
Automatic per port link width negotiation
(x8 --> x4 --> x2 --> x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
Per lane SerDes configuration
• De-emphasis
• Receive equalization
• Drive strength
Switch Partitioning
IDT proprietary feature that creates logically independent
switches in the device
Supports up to 16 fully independent switch partitions
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
• Dynamic port reconfiguration (downstream or upstream)
• Dynamic migration of ports between partitions
• Movable upstream port within and between switch partitions
Initialization / Configuration
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
• Weighted Round Robin (WRR)
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Multicast overlay mechanism support
ECRC regeneration support
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible clocking modes
• Common clock
September 25, 2008
Features
High Performance Non-Blocking Switch Architecture
34-lane 16-port PCIe switch
• Three x8 switch ports each of which can bifurcate to two x4
ports (total of six x4 ports)
• Ten x1 switch ports
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 34 GBps (272 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Compatible with IDT 89HPES34H16 PCIe Gen1 switch
Port Configurability
x8, x4, and x1 ports
Ability to merge adjacent x4 ports to create a x8 port
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 3
©
2008 Integrated Device Technology, Inc.

89H34H16G2ZBBLGI相似产品对比

89H34H16G2ZBBLGI 89H34H16G2ZBBLG 89H34H16G2ZBBLI
描述 PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156 PCI Bus Controller, PBGA1156
是否Rohs认证 符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
包装说明 BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40 FCBGA-1156
Reach Compliance Code compliant compliant compliant
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3
总线兼容性 I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA
最大时钟频率 125 MHz 125 MHz 125 MHz
最大数据传输速率 34000 MBps 34000 MBps 34000 MBps
JESD-30 代码 S-PBGA-B1156 S-PBGA-B1156 S-PBGA-B1156
长度 35 mm 35 mm 35 mm
端子数量 1156 1156 1156
最高工作温度 85 °C 70 °C 85 °C
最低工作温度 -40 °C - -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA
封装等效代码 BGA1156,34X34,40 BGA1156,34X34,40 BGA1156,34X34,40
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V 1,2.5,2.5/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 3.42 mm 3.42 mm 3.42 mm
最大压摆率 6264 mA 6264 mA 6264 mA
最大供电电压 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL
端子形式 BALL BALL BALL
端子节距 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 35 mm 35 mm 35 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1173  1381  1450  708  914  4  37  40  13  51 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved