1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | SON |
| 包装说明 | HVSON, SOLCC8,.08,20 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.08,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 0.07 mA |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 2 mm |
| LTC2912CDDB-1 | LTC2912CDDB-2 | LTC2912CTS8-2 | LTC2912CTS8-2TRPBF | LTC2912HDDB-1 | LTC2912HDDB-3 | LTC2912IDDB-2 | |
|---|---|---|---|---|---|---|---|
| 描述 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | SON | SON | TSSOP | - | SON | SON | SON |
| 包装说明 | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 | VSSOP, TSSOP8,.1 | - | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | _compli | - | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | - | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | - | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 3 mm | 3 mm | 2.9 mm | - | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | 125 °C | 125 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | HVSON | VSSOP | - | HVSON | HVSON | HVSON |
| 封装等效代码 | SOLCC8,.08,20 | SOLCC8,.08,20 | TSSOP8,.1 | - | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | - | 235 | 235 | 235 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 1 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电流 (Isup) | 0.07 mA | 0.07 mA | 0.07 mA | - | 0.07 mA | 0.07 mA | 0.07 mA |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | - | 20 | 20 | 20 |
| 宽度 | 2 mm | 2 mm | 1.625 mm | - | 2 mm | 2 mm | 2 mm |
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