12-Bit, 125/105Msps Low Power 3V ADCs
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| 制造商包装代码 | UH |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.C.2 |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 最大线性误差 (EL) | 0.0366% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 105 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 5 mm |
| LTC2252IUH | ATB202-1841-BT452W | LTC2253IUH | LTC2252CUH | |
|---|---|---|---|---|
| 描述 | 12-Bit, 125/105Msps Low Power 3V ADCs | PTC Thermistor, 1840ohm, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT | 12-bit, 125/105msps low power 3V adcs | 12-bit, 125/105msps low power 3V adcs |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | AXIAL LEADED, ROHS COMPLIANT | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.C.2 | EAR99 | 3A991.C.2 | 3A991.C.2 |
| 端子数量 | 32 | 2 | 32 | 32 |
| 最高工作温度 | 85 °C | 175 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C | - |
| 封装形状 | SQUARE | TUBULAR PACKAGE | SQUARE | SQUARE |
| 表面贴装 | YES | NO | YES | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | Pure Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子位置 | QUAD | AXIAL | QUAD | QUAD |
| Brand Name | Linear Technology | - | Linear Technology | Linear Technology |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | QFN | - | QFN | QFN |
| 针数 | 32 | - | 32 | 32 |
| 制造商包装代码 | UH | - | UH | UH |
| 最大模拟输入电压 | 1 V | - | 1 V | 1 V |
| 最小模拟输入电压 | -1 V | - | -1 V | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N32 | - | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 长度 | 5 mm | - | 5 mm | 5 mm |
| 最大线性误差 (EL) | 0.0366% | - | 0.0366% | 0.0366% |
| 湿度敏感等级 | 1 | - | 1 | 1 |
| 模拟输入通道数量 | 1 | - | 1 | 1 |
| 位数 | 12 | - | 12 | 12 |
| 功能数量 | 1 | - | 1 | 1 |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | - | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 | - | 235 | 235 |
| 电源 | 3 V | - | 3 V | 3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 采样速率 | 105 MHz | - | 125 MHz | 105 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm |
| 标称供电电压 | 3 V | - | 3 V | 3 V |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 20 |
| 宽度 | 5 mm | - | 5 mm | 5 mm |
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