KOA SPEER ELECTRONICS, INC.
SS-194 R5
AHA 6/29/06
Power Chip Inductors
Type LPC4045
1. Scope
This specification shall be applied to the LPC4045
manufactured by KOA Corporation.
CERTIFIED
CERTIFIED
2. Dimensions and Construction
E
D
F
C
F
Electrode
Ceramic Magnet
Substrate Wire
Ferrite
Core
A
B
Size
4045
A
B
Dimensions
inches
(mm)
C
D
E
.138
(3.5)
F
.039±.112
(1.0±0.3)
ø.157±.008 .169±.009 .177±.008 .118±.008
(ø4.0±0.2) (4.3±0.2) (4.5±0.2) (3.0±0.2)
3. Type Designation
The type designation shall be the following form:
New Type
LPC
Type
4045
Size
A
Termination
Material
A: SnAg
(Other termination
styles available,
contact factory
for options)
TED
Packaging
TED: 10" Embossed Plastic
1,000 pcs/reel
101
Nominal
Inductance
101: 100µH
221: 220µH
152: 1500µH
K
Tolerance
K: ±10%
M: ±20%
4045
PAGE 1 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-194 R5
4. Standard Applications
Part
Designation
LPC4045ATEDR68M
LPC4045ATED1R0M
LPC4045ATED1R5M
LPC4045ATED2R2M
LPC4045ATED3R3M
LPC4045ATED4R7M
LPC4045ATED6R8M
LPC4045ATED100K
LPC4045ATED150K
LPC4045ATED220K
LPC4045ATED330K
LPC4045ATED470K
LPC4045ATED680K
LPC4045ATED101K
LPC4045ATED151K
LPC4045ATED221K
LPC4045ATED331K
LPC4045ATED471K
LPC4045ATED681K
Inductance
(µH)
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
680
Inductance
Tolerance
Quality
Factor
Minimum
(MHz)
Self Resonant
Frequency
Minimum
(MHz)
120.0
90.0
70.0
55.0
45.0
35.0
25.0
23.5
18.5
14.0
12.0
10.5
8.0
6.3
5.2
3.9
3.0
2.7
2.2
DC
Resistance
Maximum
(Ω)
0.012
0.015
0.020
0.023
0.044
0.062
0.075
0.10
0.15
0.21
0.41
0.52
0.67
0.92
1.80
2.25
4.27
5.23
6.67
Allowable
DC Current
Maximum
(Amps)
3.40
3.10
2.80
2.50
1.80
1.45
1.30
1.02
0.84
0.70
0.52
0.46
0.40
0.28
0.25
0.18
0.15
0.14
0.12
Measured
Frequency
(Hz)
M: ±20%
20
1000
K: ±10%
40
4.1 Rating
No.
1
Item
Nominal inductance range
Specification
0.68
µH
~ 680
µH
E-6 series
Measuring Conditions: Normal testing is conducted at normal temperatures (5°C ~ 35°C) and at nominal humidity
(45% ~ 85% R. H.). If there is concern, the test may be conducted at a temperature of 20 ± 2°C and at a relative
humidity of 65 ± 5% R. H.
5. Environmental Characteristics
No.
1
2
3
4
5
6
7
8
9
10
Item
High temperature, leaving test
Low temperature, leaving test
Moisture leaving test
Heat shock test
Dropping test
Vibration test
Operating temperature range
Storage temperature range
Resistance to soldering heat
Resistance to solvent
Test Methods
85 ± 2°C 500 Hr
-40 ± 2°C 500 Hr
40 ± 2°C 90 ~ 95% R. H. 500 Hr
-40 ± 4°C/0.5 Hr
85 ± 2°C/0.5 Hr
85°C
0.5 Hr
100 cycles
-40°C
1 dropped from height of 1 meter to top of board.
2 hours in each direction of X, Y, Z at a frequency
range of 10 ~ 55 Hz with 1.5 mm amplitude.
-30°C ~ +80°C
-40°C ~ +85°C
With the temperature of the solder at 260°C +5°C, 10 seconds,
There shall be no abnormalities.
MIL-STD-202F Method 215
Q (Quality factor)
PAGE 2 OF 4
I
There shall be no abnormalities under the above conditions.
Measurement: Inductance DC Superposed characteristics LCR Meter HP4284A
Frequency: Inductance 1 MHz DC Superposed characteristics 10 KHz
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-194 R5
6. Packaging
6.1 Taping
The taping shall be embossed carrier tapes of 12 mm width
and 8 mm pitches. The standard quantity per reel shall be 1,000 pieces.
6.2 Dimensions of Taping
12.0
±
0.1
1.75
±
0.1
8.0
±
0.1
4.0
±
0.1
4.6
±
0.1
Ø1.5
±
0.1 0.4
Ø21.0
±
0.5
Ø13.0
±
0.5
80.0
±
2.0
5.5
±
0.1
4.75
±
0.2
4.15
±
0.2
2.0
±
0.3
ø250
13
±
1.0
Blank
over 50 mm
Products
1,000 pieces
Blank
Tape leader
over 50 mm 50 ~ 200 mm
Feed Direction
6.3 Packaging Method
A specially designed cardboard box is used
for the external packaging and can hold a
maximum of 20 reels.
6.4 Markings
The following information is provided
on the reel.
(1) Product name (2) Part number (3) Quality
(4) Lot number (5) Manufacture origin
6.5 Lot Number
(Example) January 21, 2006
41
Year and
Month of
Manufacture
21
Day of
Manufacture
D
Manufacture
Plant
K
Additional
Number
41...2006.1 42...2006.2 43...2006.3
PAGE 3 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-194 R5
7. General Information
7.1 Storage
Chip inductors shall not be stored under high
temperature and high humidity conditions.
Especially, do not store taping where they are
exposed to heat or direct sunlight. Otherwise,
material may be deformed, causing problems
during mounting.
7.2 Mounting
Placement force should not be excessive.
7.3 Soldering
Soldering should be done at 250°C for less
than 6 seconds. When using a soldering iron,
temperature shall not exceed 350°C and
within 3 seconds. Soldering iron time shall
be allowed only one time. After soldering, chip
inductors shall not be stressed excessively.
7.4 Cleaning
There is no problem using organic solvents.
Since these chip inductors are a coil of
ultra-thin wire, they are susceptible to
vibration. If an ultrasonic cleaning unit is
used, check for any possibility of problem
generation before practical use, since such
cleaning units differ considerably in vibration
level and mode. Although the conditions
vary depending on the printed board size,
Ultrasonic cleaning is generally used in
the conditions described in the following
examples:
Power: Within 20W/L
Cleaning times:
Within 5 minutes
7.5 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must
be separated by means of solder resists
to prevent excessive solder.
9. Land Pattern Design
9.1 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must be
separated by means of solder resists to
prevent excessive solder.
(unit: mm)
Time
Within 90
seconds
Within 45
seconds
Within 30
seconds
Within 6
seconds
1.8
1.5
1.8
8. Soldering
8.1 Conditions for Reflow Soldering
The time and temperature for reflow solder
applications are as shown below.
Temperature (°C)
230
200
160
3.5
Clean solder film 300
±
100 micron
PAGE 4 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
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