16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296 |
| 针数 | 296 |
| 制造商包装代码 | SOT1048-1 |
| Reach Compliance Code | unknown |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| 最大时钟频率 | 20 MHz |
| DAC 通道 | NO |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PBGA-B296 |
| JESD-609代码 | e1 |
| 长度 | 15 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 87 |
| 端子数量 | 296 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装等效代码 | BGA296,18X18,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.3,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 131072 |
| ROM（单词） | 16384 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.2 mm |
| 速度 | 266 MHz |
| 最大供电电压 | 1.39 V |
| 最小供电电压 | 1.31 V |
| 标称供电电压 | 1.35 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 15 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| LPC3220FET296 | LPC3220 | LPC3230FET296 | LPC3240FET296 | LPC3250 | LPC3250FET296 | |
|---|---|---|---|---|---|---|
| 描述 | 16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface | NXP Microcontrollers Selection Guide | 16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface | 16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface | NXP Microcontrollers Selection Guide | 16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | BGA | - | BGA | BGA | - | BGA |
| 包装说明 | 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296 | - | 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296 | 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296 | - | 15 X 15 MM, 0.70 MM PITCH, PLASTIC, MO-216, SOT1048-1, TFBGA-296 |
| 针数 | 296 | - | 296 | 296 | - | 296 |
| 制造商包装代码 | SOT1048-1 | - | SOT1048-1 | SOT1048-1 | - | SOT1048-1 |
| Reach Compliance Code | unknown | - | compliant | unknown | - | unknow |
| 具有ADC | YES | - | YES | YES | - | YES |
| 位大小 | 32 | - | 32 | 32 | - | 32 |
| 最大时钟频率 | 20 MHz | - | 20 MHz | 20 MHz | - | 20 MHz |
| DAC 通道 | NO | - | NO | NO | - | NO |
| DMA 通道 | YES | - | YES | YES | - | YES |
| JESD-30 代码 | S-PBGA-B296 | - | S-PBGA-B296 | S-PBGA-B296 | - | S-PBGA-B296 |
| JESD-609代码 | e1 | - | e1 | e1 | - | e1 |
| 长度 | 15 mm | - | 15 mm | 15 mm | - | 15 mm |
| 湿度敏感等级 | 3 | - | 3 | 3 | - | 3 |
| I/O 线路数量 | 87 | - | 87 | 87 | - | 87 |
| 端子数量 | 296 | - | 296 | 296 | - | 296 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| PWM 通道 | YES | - | YES | YES | - | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TFBGA | - | TFBGA | TFBGA | - | TFBGA |
| 封装等效代码 | BGA296,18X18,32 | - | BGA296,18X18,32 | BGA296,18X18,32 | - | BGA296,18X18,32 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | - | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | - | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | - | 260 |
| 电源 | 1.3,3.3 V | - | 1.3,3.3 V | 1.3,3.3 V | - | 1.3,3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| RAM（字节） | 131072 | - | 262144 | 262144 | - | 262144 |
| ROM（单词） | 16384 | - | 16384 | 16384 | - | 16384 |
| ROM可编程性 | FLASH | - | FLASH | FLASH | - | FLASH |
| 座面最大高度 | 1.2 mm | - | 1.2 mm | 1.2 mm | - | 1.2 mm |
| 速度 | 266 MHz | - | 266 MHz | 266 MHz | - | 266 MHz |
| 最大供电电压 | 1.39 V | - | 1.39 V | 1.39 V | - | 1.39 V |
| 最小供电电压 | 1.31 V | - | 1.31 V | 1.31 V | - | 1.31 V |
| 标称供电电压 | 1.35 V | - | 1.35 V | 1.35 V | - | 1.35 V |
| 表面贴装 | YES | - | YES | YES | - | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | - | BALL | BALL | - | BALL |
| 端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm | - | 0.8 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | - | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | 40 | - | 40 |
| 宽度 | 15 mm | - | 15 mm | 15 mm | - | 15 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC |
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