Programmable Three Channel LED Driver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | VFBGA, BGA20,4X5,16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 数据输入模式 | SERIAL |
| 接口集成电路类型 | LED DISPLAY DRIVER |
| JESD-30 代码 | R-PBGA-B20 |
| JESD-609代码 | e1 |
| 长度 | 2.066 mm |
| 湿度敏感等级 | 1 |
| 复用显示功能 | NO |
| 功能数量 | 1 |
| 区段数 | 3 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA20,4X5,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.675 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3.6 V |
| 表面贴装 | YES |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 宽度 | 1.717 mm |
| 最小 fmax | 0.4 MHz |
| LP5521TM | LP5521 | LP5521TMX | LP5521YQ | LP5521YQX | |
|---|---|---|---|---|---|
| 描述 | Programmable Three Channel LED Driver | Programmable Three Channel LED Driver | Programmable Three Channel LED Driver | Programmable Three Channel LED Driver | Programmable Three Channel LED Driver |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | VFBGA, BGA20,4X5,16 | - | VFBGA, BGA20,4X5,16 | 5 X 4 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, LLP-24 | 5 X 4 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, LLP-24 |
| Reach Compliance Code | compli | - | compli | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 数据输入模式 | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 接口集成电路类型 | LED DISPLAY DRIVER | - | LED DISPLAY DRIVER | LED DISPLAY DRIVER | LED DISPLAY DRIVER |
| JESD-30 代码 | R-PBGA-B20 | - | R-PBGA-B20 | R-XQCC-N24 | R-XQCC-N24 |
| JESD-609代码 | e1 | - | e1 | e1 | e1 |
| 长度 | 2.066 mm | - | 2.066 mm | 5 mm | 5 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 |
| 复用显示功能 | NO | - | NO | NO | NO |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 区段数 | 3 | - | 3 | 3 | 3 |
| 端子数量 | 20 | - | 20 | 24 | 24 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -30 °C | - | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | VFBGA | - | VFBGA | HVQCCN | HVQCCN |
| 封装等效代码 | BGA20,4X5,16 | - | BGA20,4X5,16 | LCC24,.16X.2,20 | LCC24,.16X.2,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.675 mm | - | 0.675 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 温度等级 | OTHER | - | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | - | BALL | NO LEAD | NO LEAD |
| 端子节距 | 0.4 mm | - | 0.4 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | BOTTOM | QUAD | QUAD |
| 宽度 | 1.717 mm | - | 1.717 mm | 4 mm | 4 mm |
| 最小 fmax | 0.4 MHz | - | 0.4 MHz | 0.4 MHz | 0.4 MHz |
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