POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N40 |
| 长度 | 5 mm |
| 信道数量 | 3 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| LP3971SQX-A514 | LP3971 | LP3971SQ-A514 | LP3971SQ-B410 | LP3971SQX-B410 | |
|---|---|---|---|---|---|
| 描述 | POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS | POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS | POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS | POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS | POWER MANAGEMENT UNIT FOR ADVANCED APPLICATION PROCESSORS |
| 是否Rohs认证 | 符合 | - | 符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | HVQCCN, | - | HVQCCN, | 5 X 5 MM, LLP-40 | 5 X 5 MM, LLP-40 |
| Reach Compliance Code | compli | - | compli | _compli | _compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | - | NO | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N40 | - | S-PQCC-N40 | S-PQCC-N40 | S-PQCC-N40 |
| 长度 | 5 mm | - | 5 mm | 5 mm | 5 mm |
| 信道数量 | 3 | - | 3 | 3 | 3 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 40 | - | 40 | 40 | 40 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.4 mm | 0.4 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | 40 | 40 |
| 宽度 | 5 mm | - | 5 mm | 5 mm | 5 mm |
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