PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | QCCN, LCC16,.14SQ,20 |
| Reach Compliance Code | unknow |
| Is Samacsys | N |
| 其他特性 | DUAL MODULUS PRESCALER: 64/65 OR 128/129 |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-PQCC-N16 |
| JESD-609代码 | e0 |
| 长度 | 3.5 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCN |
| 封装等效代码 | LCC16,.14SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 4 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.5 mm |
| Base Number Matches | 1 |
| LMX2335USLBX | LMX2335U | LMX2335UTM | LMX2335UTMX | LMX2336U | LMX2336USLBX | LMX2336USLEX | LMX2336UTM | LMX2336UTMX | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications | PLLatinum Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications |
| 是否Rohs认证 | 不符合 | - | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | - | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | QCCN, LCC16,.14SQ,20 | - | - | - | - | QCCN, LCC24,.17X.14,20 | VQCCN, LCC20,.14SQ,20 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 |
| Reach Compliance Code | unknow | - | - | - | - | unknow | unknow | compli | compli |
| Is Samacsys | N | - | - | - | - | N | N | N | N |
| 其他特性 | DUAL MODULUS PRESCALER: 64/65 OR 128/129 | - | - | - | - | DUAL MODULUS PRESCALER: 64/65 OR 128/129 | DUAL MODULUS PRESCALER: 64/65 OR 128/129 | DUAL MODULUS PRESCALER: 64/65 OR 128/129 | DUAL MODULUS PRESCALER: 64/65 OR 128/129 |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | - | - | - | - | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-PQCC-N16 | - | - | - | - | R-PQCC-N24 | S-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | - | - | - | - | e0 | e0 | e0 | e0 |
| 长度 | 3.5 mm | - | - | - | - | 4.5 mm | 3.5 mm | 6.5 mm | 6.5 mm |
| 功能数量 | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | - | - | - | 24 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | - | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | - | - | - | - | QCCN | VQCCN | TSSOP | TSSOP |
| 封装等效代码 | LCC16,.14SQ,20 | - | - | - | - | LCC24,.17X.14,20 | LCC20,.14SQ,20 | TSSOP20,.25 | TSSOP20,.25 |
| 封装形状 | SQUARE | - | - | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | - | - | - | CHIP CARRIER | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
| 电源 | 3/5 V | - | - | - | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | - | - | - | - | 1.1 mm | 0.6 mm | 1.1 mm | 1.1 mm |
| 最大供电电流 (Isup) | 4 mA | - | - | - | - | 4.5 mA | 4.6 mA | 4.6 mA | 4.5 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | - | - | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | - | - | - | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | - | - | - | YES | YES | YES | YES |
| 技术 | BICMOS | - | - | - | - | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | - | - | - | - | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | - | - | - | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | - | - | - | - | QUAD | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.5 mm | - | - | - | - | 3.5 mm | 3.5 mm | 4.4 mm | 4.4 mm |
| Base Number Matches | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
51单片机
RF/无线
模拟与混合信号
瑞萨电子MCU
模拟电子
单片机
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