|
LMV7275MFX |
LMV7271MF |
LMV7272TL |
LMV7275MF |
LMV7275MGX |
LMV7271 |
LMV7272 |
LMV7275 |
描述 |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
- |
- |
- |
厂商名称 |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
- |
- |
- |
零件包装代码 |
SOT-23 |
SOT-23 |
BGA |
SOT-23 |
SC-70 |
- |
- |
- |
包装说明 |
SOT-23, 5 PIN |
SOT-23, 5 PIN |
MICRO, SMD-8 |
SOT-23, 5 PIN |
SC-70, 5 PIN |
- |
- |
- |
针数 |
5 |
5 |
8 |
5 |
5 |
- |
- |
- |
Reach Compliance Code |
_compli |
not_compliant |
not_compliant |
_compli |
_compli |
- |
- |
- |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
- |
- |
放大器类型 |
COMPARATOR |
COMPARATOR |
COMPARATOR |
COMPARATOR |
COMPARATOR |
- |
- |
- |
最大输入失调电压 |
4000 µV |
4000 µV |
4000 µV |
4000 µV |
4000 µV |
- |
- |
- |
JESD-30 代码 |
R-PDSO-G5 |
R-PDSO-G5 |
S-PBGA-B8 |
R-PDSO-G5 |
R-PDSO-G5 |
- |
- |
- |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
- |
- |
- |
长度 |
2.92 mm |
2.92 mm |
1.514 mm |
2.92 mm |
2 mm |
- |
- |
- |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
- |
- |
- |
功能数量 |
1 |
1 |
1 |
1 |
1 |
- |
- |
- |
端子数量 |
5 |
5 |
8 |
5 |
5 |
- |
- |
- |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
- |
- |
- |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
- |
- |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
- |
封装代码 |
LSSOP |
LSSOP |
VFBGA |
LSSOP |
TSSOP |
- |
- |
- |
封装等效代码 |
TSOP5/6,.11,37 |
TSOP5/6,.11,37 |
BGA8,3X3,20 |
TSOP5/6,.11,37 |
TSSOP5/6,.08 |
- |
- |
- |
封装形状 |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
- |
- |
- |
封装形式 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
- |
- |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
- |
- |
- |
电源 |
1.8/5 V |
1.8/5 V |
1.8/5 V |
1.8/5 V |
1.8/5 V |
- |
- |
- |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
- |
标称响应时间 |
2100 ns |
1100 ns |
1100 ns |
2100 ns |
2100 ns |
- |
- |
- |
座面最大高度 |
1.22 mm |
1.22 mm |
0.6 mm |
1.22 mm |
1.1 mm |
- |
- |
- |
最大压摆率 |
0.016 mA |
0.016 mA |
0.03 mA |
0.016 mA |
0.016 mA |
- |
- |
- |
供电电压上限 |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
- |
- |
标称供电电压 (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
- |
- |
- |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
- |
- |
- |
技术 |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
- |
- |
- |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
- |
- |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
- |
- |
端子形式 |
GULL WING |
GULL WING |
BALL |
GULL WING |
GULL WING |
- |
- |
- |
端子节距 |
0.95 mm |
0.95 mm |
0.5 mm |
0.95 mm |
0.65 mm |
- |
- |
- |
端子位置 |
DUAL |
DUAL |
BOTTOM |
DUAL |
DUAL |
- |
- |
- |
处于峰值回流温度下的最长时间 |
40 |
40 |
40 |
40 |
40 |
- |
- |
- |
宽度 |
1.6 mm |
1.6 mm |
1.514 mm |
1.6 mm |
1.25 mm |
- |
- |
- |