OP-AMP, 750 uV OFFSET-MAX, PDSO8
运算放大器, 750 uV 最大补偿, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 零件包装代码 | SOT-23 |
| 包装说明 | SOT-23, 5 PIN |
| 针数 | 5 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA |
| 标称共模抑制比 | 90 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 750 µV |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e0 |
| 长度 | 2.92 mm |
| 低-失调 | YES |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | -6.6 V |
| 标称负供电电压 (Vsup) | -2.5 V |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | +-2.5/+-6/+5/+12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.22 mm |
| 标称压摆率 | 300 V/us |
| 最大压摆率 | 18 mA |
| 供电电压上限 | 6.6 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 最小电压增益 | 3160 |
| 宽带 | YES |
| 宽度 | 1.6 mm |
| LMH6624MF | LMH6624_05 | LMH6626 | LMH6624MA | LMH6626MAX | LMH6626MM | LMH6626MMX | LMH6624MFX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 | OP-AMP, 750 uV OFFSET-MAX, PDSO8 |
| 放大器类型 | OPERATIONAL AMPLIFIER | 运算放大器 | 运算放大器 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大输入失调电压 | 750 µV | 750 mV | 750 mV | 750 µV | 750 µV | 750 µV | 750 µV | 750 µV |
| 功能数量 | 1 | 1 | 1 | 1 | 2 | 2 | 2 | 1 |
| 端子数量 | 5 | 8 | 8 | 8 | 8 | 8 | 8 | 5 |
| 表面贴装 | YES | Yes | Yes | YES | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | 双 | 双 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 零件包装代码 | SOT-23 | - | - | SOIC | SOIC | SOIC | SOIC | SOT-23 |
| 包装说明 | SOT-23, 5 PIN | - | - | SOIC-8 | SOIC-8 | MSOP-8 | MSOP-8 | SOT-23, 5 PIN |
| 针数 | 5 | - | - | 8 | 8 | 8 | 8 | 5 |
| Reach Compliance Code | _compli | - | - | _compli | _compli | _compli | _compli | _compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 架构 | VOLTAGE-FEEDBACK | - | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 20 µA | - | - | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA | - | - | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 标称共模抑制比 | 90 dB | - | - | 90 dB | 90 dB | 90 dB | 90 dB | 90 dB |
| 频率补偿 | YES | - | - | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PDSO-G5 | - | - | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G5 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | 2.92 mm | - | - | 4.902 mm | 4.902 mm | 3 mm | 3 mm | 2.92 mm |
| 低-失调 | YES | - | - | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 负供电电压上限 | -6.6 V | - | - | -6.6 V | -6.6 V | -6.6 V | -6.6 V | -6.6 V |
| 标称负供电电压 (Vsup) | -2.5 V | - | - | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V |
| 最高工作温度 | 125 °C | - | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | - | - | SOP | SOP | TSSOP | TSSOP | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 | - | - | SOP8,.25 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL | - | - | RAIL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | - | - | 235 | 235 | 260 | 260 | 260 |
| 电源 | +-2.5/+-6/+5/+12 V | - | - | +-2.5/+-6/+5/+12 V | 5/12/+-2.5/+-6 V | 5/12/+-2.5/+-6 V | 5/12/+-2.5/+-6 V | +-2.5/+-6/+5/+12 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.22 mm | - | - | 1.753 mm | 1.753 mm | 1.09 mm | 1.09 mm | 1.22 mm |
| 标称压摆率 | 300 V/us | - | - | 300 V/us | 300 V/us | 300 V/us | 300 V/us | 300 V/us |
| 最大压摆率 | 18 mA | - | - | 18 mA | 36 mA | 36 mA | 36 mA | 18 mA |
| 供电电压上限 | 6.6 V | - | - | 6.6 V | 6.6 V | 6.6 V | 6.6 V | 6.6 V |
| 标称供电电压 (Vsup) | 2.5 V | - | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 技术 | BIPOLAR | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 0.95 mm | - | - | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.95 mm |
| 处于峰值回流温度下的最长时间 | 40 | - | - | 30 | 30 | 40 | 40 | 40 |
| 最小电压增益 | 3160 | - | - | 3160 | 2200 | 2200 | 2200 | 3160 |
| 宽带 | YES | - | - | YES | YES | YES | YES | YES |
| 宽度 | 1.6 mm | - | - | 3.899 mm | 3.899 mm | 3 mm | 3 mm | 1.6 mm |
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