OP-AMP
运算放大器
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
零件包装代码 | DIP |
包装说明 | DIP-14 |
针数 | 14 |
Reach Compliance Code | _compli |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.000004 µA |
25C 时的最大偏置电流 (IIB) | 0.000004 µA |
最小共模抑制比 | 62 dB |
标称共模抑制比 | 82 dB |
频率补偿 | YES |
最大输入失调电压 | 3700 µV |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
长度 | 19.18 mm |
低-偏置 | YES |
低-失调 | NO |
湿度敏感等级 | 1 |
负供电电压上限 | |
标称负供电电压 (Vsup) | |
功能数量 | 4 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
包装方法 | RAIL |
峰值回流温度(摄氏度) | 260 |
电源 | 3/15 V |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最小摆率 | 0.63 V/us |
标称压摆率 | 1.3 V/us |
最大压摆率 | 4 mA |
供电电压上限 | 16 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
标称均一增益带宽 | 1500 kHz |
最小电压增益 | 10000 |
宽度 | 7.62 mm |
LMC6484IN | LMC6484 | LMC6484AIM | LMC6484AIN | LMC6484AMJ/883 | LMC6484AMWG/883 | LMC6484IM | LMC6484MN | |
---|---|---|---|---|---|---|---|---|
描述 | OP-AMP | OP-AMP | OP-AMP | OP-AMP | OP-AMP | OP-AMP | QUAD OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO14 | OP-AMP |
放大器类型 | OPERATIONAL AMPLIFIER | OP-AMP | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
零件包装代码 | DIP | - | SOIC | DIP | DIP | SOIC | SOIC | DIP |
包装说明 | DIP-14 | - | SOIC-14 | DIP-14 | DIP, DIP14,.3 | SOP, DIP14,.3 | SOIC-14 | DIP, DIP14,.3 |
针数 | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | _compli | - | _compli | not_compliant | _compli | _compli | not_compliant | unknow |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
架构 | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.000004 µA | - | 0.000004 µA | 0.000004 µA | 0.0001 µA | 0.0001 µA | 0.000004 µA | 0.0001 µA |
25C 时的最大偏置电流 (IIB) | 0.000004 µA | - | 0.000004 µA | 0.000004 µA | 0.0001 µA | 0.0001 µA | 0.000004 µA | 0.00001 µA |
最小共模抑制比 | 62 dB | - | 67 dB | 67 dB | - | - | 62 dB | 60 dB |
标称共模抑制比 | 82 dB | - | 82 dB | 82 dB | 62 dB | 62 dB | 74 dB | 82 dB |
频率补偿 | YES | - | YES | YES | YES | YES | YES | YES |
最大输入失调电压 | 3700 µV | - | 1350 µV | 1350 µV | 1.35 µV | 1.35 µV | 3000 µV | 3800 µV |
JESD-30 代码 | R-PDIP-T14 | - | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 | R-CDSO-G14 | R-PDSO-G14 | R-PDIP-T14 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 19.18 mm | - | 8.6235 mm | 19.18 mm | 19.43 mm | - | 8.6235 mm | 19.18 mm |
低-偏置 | YES | - | YES | YES | YES | YES | YES | YES |
低-失调 | NO | - | NO | NO | NO | NO | NO | NO |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
功能数量 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | - | SOP | DIP | DIP | SOP | SOP | DIP |
封装等效代码 | DIP14,.3 | - | SOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
包装方法 | RAIL | - | RAIL | RAIL | RAIL | TRAY | RAIL | - |
峰值回流温度(摄氏度) | 260 | - | 235 | 260 | 260 | 260 | 235 | NOT SPECIFIED |
电源 | 3/15 V | - | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | - | 1.753 mm | 5.08 mm | 5.08 mm | 2.33 mm | 1.753 mm | 5.08 mm |
最小摆率 | 0.63 V/us | - | 0.7 V/us | 0.7 V/us | 0.54 V/us | 0.54 V/us | 0.63 V/us | 0.54 V/us |
标称压摆率 | 1.3 V/us | - | 1.3 V/us | 1.3 V/us | 0.6 V/us | 0.6 V/us | 0.9 V/us | 1.3 V/us |
最大压摆率 | 4 mA | - | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
供电电压上限 | 16 V | - | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 3 V | 5 V |
表面贴装 | NO | - | YES | NO | NO | YES | YES | NO |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | - | 30 | 40 | 40 | 40 | 30 | NOT SPECIFIED |
标称均一增益带宽 | 1500 kHz | - | 1500 kHz | 1500 kHz | 1150 kHz | 1150 kHz | 1000 kHz | 1500 kHz |
最小电压增益 | 10000 | - | 13000 | 13000 | 8000 | 8000 | 10000 | 8000 |
宽度 | 7.62 mm | - | 3.899 mm | 7.62 mm | 7.62 mm | 6.35 mm | 3.899 mm | 7.62 mm |
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