DUAL OP-AMP, 750 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDIP8
双运算放大器, 750 uV 最大补偿, 1.5 MHz 波段 宽度, PDIP8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 零件包装代码 | DIP |
| 包装说明 | PLASTIC, DIP-8 |
| 针数 | 8 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.000004 µA |
| 最小共模抑制比 | 67 dB |
| 标称共模抑制比 | 82 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 750 µV |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 长度 | 9.817 mm |
| 低-偏置 | YES |
| 低-失调 | NO |
| 微功率 | YES |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | |
| 标称负供电电压 (Vsup) | |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | RAIL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最小摆率 | 0.7 V/us |
| 标称压摆率 | 1.3 V/us |
| 最大压摆率 | 1.9 mA |
| 供电电压上限 | 16 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 标称均一增益带宽 | 1500 kHz |
| 最小电压增益 | 13000 |
| 宽度 | 7.62 mm |
| LMC6482AIN | LMC6482 | LMC6482AIM | LMC6482AMJ/883 | LMC6482IM | LMC6482IMM | LMC6482IN | LMC6482MN | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DUAL OP-AMP, 750 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDIP8 | OP-AMP | OP-AMP | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, CDIP8 | OP-AMP | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDSO8 | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDIP8 | OP-AMP |
| 放大器类型 | OPERATIONAL AMPLIFIER | 运算放大器 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | 运算放大器 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 零件包装代码 | DIP | - | SOIC | DIP | SOIC | SOIC | DIP | - |
| 包装说明 | PLASTIC, DIP-8 | - | SOP, SOP8,.25 | DIP, DIP8,.3 | SO-8 | MSOP-8 | PLASTIC, DIP-8 | - |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | _compli | - | _compli | _compli | _compli | _compli | _compli | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 架构 | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - |
| 最大平均偏置电流 (IIB) | 0.000004 µA | - | 0.000004 µA | 0.0001 µA | 0.000004 µA | - | 0.000004 µA | - |
| 标称共模抑制比 | 82 dB | - | 82 dB | 82 dB | 82 dB | 82 dB | 82 dB | - |
| 频率补偿 | YES | - | YES | YES | YES | YES | YES | - |
| 最大输入失调电压 | 750 µV | - | 750 µV | 3000 µV | 3000 µV | 3000 µV | 3000 µV | - |
| JESD-30 代码 | R-PDIP-T8 | - | R-PDSO-G8 | R-GDIP-T8 | R-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | - |
| 长度 | 9.817 mm | - | 4.9 mm | - | 4.9 mm | 3 mm | 9.817 mm | - |
| 低-偏置 | YES | - | YES | YES | YES | YES | YES | - |
| 低-失调 | NO | - | NO | NO | NO | NO | NO | - |
| 微功率 | YES | - | YES | NO | YES | YES | YES | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 2 | - | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 8 | - | 8 | 8 | 8 | 8 | 8 | - |
| 最高工作温度 | 85 °C | - | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | - | SOP | DIP | SOP | TSSOP | DIP | - |
| 封装等效代码 | DIP8,.3 | - | SOP8,.25 | DIP8,.3 | SOP8,.25 | TSSOP8,.19 | DIP8,.3 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | - |
| 包装方法 | RAIL | - | RAIL | - | RAIL | RAIL | RAIL | - |
| 峰值回流温度（摄氏度） | 260 | - | 235 | 260 | 235 | 260 | 260 | - |
| 电源 | 3/15 V | - | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.08 mm | - | 1.75 mm | 5.08 mm | 1.75 mm | 1.1 mm | 5.08 mm | - |
| 最小摆率 | 0.7 V/us | - | 0.7 V/us | 0.6 V/us | 0.63 V/us | 0.63 V/us | 0.63 V/us | - |
| 标称压摆率 | 1.3 V/us | - | 1.3 V/us | 1.3 V/us | 1.3 V/us | 1.3 V/us | 1.3 V/us | - |
| 最大压摆率 | 1.9 mA | - | 1.9 mA | 2 mA | 1.9 mA | 1.9 mA | 1.9 mA | - |
| 供电电压上限 | 16 V | - | 16 V | 16 V | 16 V | 16 V | 16 V | - |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | - | YES | NO | YES | YES | NO | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 2.54 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 40 | - | 30 | 40 | 30 | 40 | 40 | - |
| 标称均一增益带宽 | 1500 kHz | - | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | - |
| 最小电压增益 | 13000 | - | 13000 | 13000 | 10000 | 10000 | 10000 | - |
| 宽度 | 7.62 mm | - | 3.9 mm | 7.62 mm | 3.9 mm | 3 mm | 7.62 mm | - |
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