1 CHANNEL, VIDEO AMPLIFIER, PDIP8
1 通道, 视频放大器, PDIP8
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最大工作温度 | 125 Cel |
| 最小工作温度 | -55 Cel |
| 最大供电/工作电压 | 32 V |
| 最小供电/工作电压 | 4.75 V |
| 加工封装描述 | 塑料, DIP-8 |
| 状态 | DISCONTINUED |
| 工艺 | BIPOLAR |
| 包装形状 | 矩形的 |
| 包装尺寸 | IN-线 |
| 端子形式 | THROUGH-孔 |
| 端子间距 | 2.54 mm |
| 端子涂层 | 锡 铅 |
| 端子位置 | 双 |
| 包装材料 | 塑料/环氧树脂 |
| 温度等级 | MILITARY |
| 消费IC类型 | 视频放大器 |
| 通道数 | 1 |
| LM6262N | LM6162 | LM6162E/883 | LM6162J/883 | LM6162N | LM6162W/883 | LM6262 | LM6362 | LM6362N | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 | 1 CHANNEL, VIDEO AMPLIFIER, PDIP8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 20 | 8 | 8 | 10 | 8 | 8 | 8 |
| 端子形式 | THROUGH-孔 | THROUGH-孔 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-孔 | THROUGH-孔 | THROUGH-HOLE |
| 端子位置 | 双 | 双 | QUAD | DUAL | DUAL | DUAL | 双 | 双 | DUAL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 |
| 厂商名称 | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） |
| 包装说明 | - | - | HQCCN, | DIP, | DIP, | DFP, | - | - | DIP, |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow | - | - | unknow |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
| 放大器类型 | - | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | - | OPERATIONAL AMPLIFIER |
| JESD-30 代码 | - | - | S-CQCC-N20 | R-GDIP-T8 | R-PDIP-T8 | R-GDFP-F10 | - | - | R-PDIP-T8 |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | - | - | e0 |
| 封装主体材料 | - | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | - | PLASTIC/EPOXY |
| 封装代码 | - | - | HQCCN | DIP | DIP | DFP | - | - | DIP |
| 封装形状 | - | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | - | - | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | - | - | IN-LINE |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| 座面最大高度 | - | - | 1.905 mm | 5.08 mm | 5.08 mm | 2.032 mm | - | - | 5.08 mm |
| 表面贴装 | - | - | YES | NO | NO | YES | - | - | NO |
| 技术 | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | - | BIPOLAR |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 端子节距 | - | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | - | 2.54 mm |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 宽度 | - | - | 8.89 mm | 7.62 mm | 7.62 mm | 6.32 mm | - | - | 7.62 mm |
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