Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.035 µA |
| 频率补偿 | YES |
| 最大输入失调电压 | 7000 µV |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.304 mm |
| 低-失调 | NO |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 4/36 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最小摆率 | 0.45 V/us |
| 最大压摆率 | 1.07 mA |
| 供电电压上限 | 18 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最小电压增益 | 40000 |
| 宽度 | 7.62 mm |
| LM613MN | LM613 | LM613AIN | LM613AME/883 | LM613AMJ/883 | LM613AMN | LM613CN | LM613IN | LM613IWM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference | Dual Operational Amplifiers, Dual Comparators, and Adjustable Reference |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 零件包装代码 | DIP | - | DIP | QFN | DIP | DIP | DIP | DIP | SOIC |
| 包装说明 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | CERDIP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 |
| 针数 | 16 | - | 16 | 20 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | - | unknow | unknow | _compli | unknow | unknow | unknow | _compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.035 µA | - | 0.025 µA | 0.025 µA | 0.025 µA | 0.025 µA | 0.035 µA | 0.035 µA | 0.035 µA |
| 频率补偿 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 7000 µV | - | 3500 µV | 6000 µV | 3500 µV | 6000 µV | 7000 µV | 7000 µV | 7000 µV |
| JESD-30 代码 | R-PDIP-T16 | - | R-PDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.304 mm | - | 19.304 mm | 8.89 mm | 19.304 mm | 19.304 mm | 19.304 mm | 19.304 mm | 10.3 mm |
| 低-失调 | NO | - | NO | NO | NO | NO | NO | NO | NO |
| 功能数量 | 1 | - | 2 | 1 | 2 | 1 | 1 | 1 | 2 |
| 端子数量 | 16 | - | 16 | 20 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 85 °C | 125 °C | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -40 °C | -55 °C | -55 °C | -55 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | QCCN | DIP | DIP | DIP | DIP | SOP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.4 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 4/36 V | - | 4/36 V | 4/36 V | 4/36 V | 4/36 V | 4/32 V | 4/36 V | 4/36 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 1.905 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.65 mm |
| 最小摆率 | 0.45 V/us | - | 0.45 V/us | 0.45 V/us | 0.45 V/us | 0.45 V/us | 0.45 V/us | 0.45 V/us | 0.45 V/us |
| 最大压摆率 | 1.07 mA | - | 1 mA | 1 mA | 1 mA | 1 mA | 1.07 mA | 1.07 mA | 1.07 mA |
| 供电电压上限 | 18 V | - | 18 V | 18 V | 36 V | 18 V | 18 V | 18 V | 36 V |
| 表面贴装 | NO | - | NO | YES | NO | NO | NO | NO | YES |
| 技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | - | INDUSTRIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 最小电压增益 | 40000 | - | 40000 | 40000 | 40000 | - | 40000 | 40000 | 40000 |
| 宽度 | 7.62 mm | - | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm |
模拟电子
stm32/stm8
无线连接
嵌入式系统
无线连接
51单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
