Boomer Series: 3W Audio Amplifier with Shutdown Mode 8-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 10% |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.902 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 1.5 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 235 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.753 mm |
| 最大压摆率 | 10 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.899 mm |
| Base Number Matches | 1 |
| LM4871M | LM4871LD | LM4871MM | LM4871MX | |
|---|---|---|---|---|
| 描述 | Boomer Series: 3W Audio Amplifier with Shutdown Mode 8-SOIC -40 to 85 | Boomer Series: 3W Audio Amplifier with Shutdown Mode 8-WSON -40 to 85 | Audio Amplifiers 3W Audio Power Amplifier with Shutdown Mode 8-VSSOP -40 to 85 | Boomer Series: 3W Audio Amplifier with Shutdown Mode 8-SOIC -40 to 85 |
| 零件包装代码 | SOIC | SOIC | MSOP | SOIC |
| 包装说明 | SOP, SOP8,.25 | HVSSON, SOLCC8,.15,32 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | _compli | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | R-PDSO-G8 | S-XDSO-N8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 4.902 mm | 4 mm | 3 mm | 4.902 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 1.5 W | 3 W | 1.5 W | 3 W |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | HVSSON | TSSOP | SOP |
| 封装等效代码 | SOP8,.25 | SOLCC8,.15,32 | TSSOP8,.19 | SOP8,.25 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 235 | 235 | 260 | 235 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.753 mm | 0.8 mm | 1.09 mm | 1.753 mm |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.8 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.899 mm | 4 mm | 3 mm | 3.899 mm |
| Brand Name | Texas Instruments | Texas Instruments | - | Texas Instruments |
| Factory Lead Time | 1 week | - | 1 week | 1 week |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 电源 | - | 5 V | 5 V | 5 V |
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