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MX25L4005AM2C-12: 产品描述EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.200 INCH, SOP-8; 产品类别存储存储; 文件大小728KB，共42页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx

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MX25L4005AM2C-12概述

EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.200 INCH, SOP-8

MX25L4005AM2C-12规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Macronix
零件包装代码	SOIC
包装说明	SOP, SOP8,.3
针数	8
Reach Compliance Code	unknow
ECCN代码	3A991.B.1.B.1
最大时钟频率 (fCLK)	33 MHz
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e0
长度	5.28 mm
内存密度	4194304 bi
内存集成电路类型	EEPROM
内存宽度	1
功能数量	1
端子数量	8
字数	4194304 words
字数代码	4000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	4MX1
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/3.3 V
认证状态	Not Qualified
座面最大高度	2.16 mm
串行总线类型	3-WIRE
最大待机电流	0.00001 A
最大压摆率	0.015 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
类型	NOR TYPE
宽度	5.23 mm
写保护	HARDWARE/SOFTWARE

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MX25L4005A

4M-BIT [x 1] CMOS SERIAL FLASH

FEATURES

GENERAL

• Serial Peripheral Interface (SPI) compatible -- Mode 0 and Mode 3

• 4,194,304 x 1 bit structure

• 128 Equal Sectors with 4K byte each

- Any Sector can be erased individually

• 8 Equal Blocks with 64K byte each

- Any Block can be erased individually

• Single Power Supply Operation

- 2.7 to 3.6 volt for read, erase, and program operations

• Latch-up protected to 100mA from -1V to Vcc +1V

• Low Vcc write inhibit is from 1.5V to 2.5V

PERFORMANCE

• High Performance

- Fast access time: 85MHz serial clock (15pF + 1TTL Load) and 66MHz serial clock (30pF + 1TTL Load)

- Fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page)

- Fast erase time: 60ms(typ.) and 120ms(max.)/sector (4K-byte per sector) ; 1s(typ.) and 2s(max.)/block (64K-byte per

block)

• Low Power Consumption

- Low active read current: 12mA(max.) at 85MHz, 8mA(max.) at 66MHz and 4mA(max.) at 33MHz

- Low active programming current: 15mA (max.)

- Low active erase current: 15mA (max.)

- Low standby current: 10uA (max.)

- Deep power-down mode 1uA (typical)

• Minimum 100,000 erase/program cycles

SOFTWARE FEATURES

• Input Data Format

- 1-byte Command code

• Block Lock protection

- The BP0~BP2 status bit defines the size of the area to be software protected against Program and Erase instructions.

• Auto Erase and Auto Program Algorithm

Automatically erases and verifies data at selected sector

Automatically programs and verifies data at selected page by an internal algorithm that automatically times the

program pulse widths (Any page to be programed should have page in the erased state first)

•

Status Register Feature

•

Electronic Identification

JEDEC 2-byte Device ID

- RES command, 1-byte Device ID

HARDWARE FEATURES

•

SCLK Input

Serial clock input

• SI Input

Serial Data Input

• SO Output

Serial Data Output

• WP# pin

Hardware write protection

P/N: PM1231

REV. 1.4, NOV. 06, 2006

MX25L4005AM2C-12相似产品对比

	MX25L4005AM2C-12	MX25L4005AMC-12	MX25L4005AMI-12	MX25L4005AM2I-12
描述	EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.200 INCH, SOP-8	EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.150 INCH, MS-012, SOP-8	EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.150 INCH, MS-012, SOP-8	EEPROM, 4MX1, Serial, CMOS, PDSO8, 0.200 INCH, SOP-8
是否Rohs认证	不符合	不符合	不符合	不符合
零件包装代码	SOIC	SOIC	SOIC	SOIC
包装说明	SOP, SOP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.3
针数	8	8	8	8
Reach Compliance Code	unknow	unknown	unknown	unknown
ECCN代码	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1
最大时钟频率 (fCLK)	33 MHz	33 MHz	33 MHz	33 MHz
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e0	e0	e0	e0
长度	5.28 mm	4.9 mm	4.9 mm	5.28 mm
内存密度	4194304 bi	4194304 bit	4194304 bit	4194304 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	1	1	1	1
功能数量	1	1	1	1
端子数量	8	8	8	8
字数	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	85 °C
组织	4MX1	4MX1	4MX1	4MX1
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	SOP	SOP
封装等效代码	SOP8,.3	SOP8,.25	SOP8,.25	SOP8,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.16 mm	1.75 mm	1.75 mm	2.16 mm
串行总线类型	3-WIRE	3-WIRE	3-WIRE	3-WIRE
最大待机电流	0.00001 A	0.00001 A	0.00001 A	0.00001 A
最大压摆率	0.015 mA	0.015 mA	0.015 mA	0.015 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	5.23 mm	3.9 mm	3.9 mm	5.23 mm
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

MX25L4005AM2C-12

MX25L4005AM2C-12概述

MX25L4005AM2C-12规格参数

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