3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL
ISM88 Series
Product Features:
Surface Mount Package
Low Jitter
Reflow Compatible
Compatible with Leadfree Processing
Applications:
Test Equipment
Server & Storage
Sonet /SDH
Frequency
Output Level
25 MHz to 350.000 MHz
V
OH
= V
CC
- 1.02 VDC Min.
V
OL
= V
cc
- 1.62 VDC Max.
50% ±5%
1.0 nS Max.
50
to Vcc - 2.0 VDC
±25ppm
2 mS Max.
200 nS Max.
Recommended Pad Layout
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
Enable Phase Delay
Disable Phase
Delay
Supply Voltage
Current
Operating
Storage
See Input Voltage Table, Tolerance ±5 %
55 mA Typical, 90 mA Max.
0
C to +70
C
-40
C to +85
C
Pin Connection
1
Enable
2
N.C.
3
V
SS
4
Output
5
Comp. Output
6
V
DD
Dimension Units: mm
Integrated Jitter
RMS
0.3 typ. (12 KHz to 20 MHz Band)
Part Number Guide
Package
Input
Voltage
3 = 3.3 V
6 = 2.5 V
Sample Part Number:
Operating
Temperature
1 = 0 C to +70 C
2 = -40 C to +85 C
ISM88 – 3159AH - 156.250
Output
9 = LVPECL
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
Stability
(in ppm)
A =
25*
Z =
30
B =
50
C =
100
Enable /
Disable
H = Enable
Frequency
- 156.250 MHz
ISM88
-
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available for all
temperature ranges and frequencies.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
01/11_A
Specifications subject to change without notice
Page 1
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL
ISM88 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
01/11_A
Specifications subject to change without notice
Page 2
Microchip MCU
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