16M X 16 DDR DRAM, 0.4 ns, PBGA84
16M × 16 双倍速率同步动态随机存储器 动态随机存取存储器, 0.4 ns, PBGA84
参数名称 | 属性值 |
最大时钟频率 | 400 MHz |
功能数量 | 1 |
端子数量 | 84 |
最小工作温度 | -40 Cel |
最大工作温度 | 85 Cel |
额定供电电压 | 1.8 V |
最小供电/工作电压 | 1.7 V |
最大供电/工作电压 | 1.9 V |
加工封装描述 | 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 |
each_compli | Yes |
欧盟RoHS规范 | Yes |
状态 | EOL |
sub_category | DRAMs |
存取方式 | FOUR BANK PAGE BURST |
ccess_time_max | 0.4000 ns |
interleaved_burst_length | 4,8 |
i_o_type | COMMON |
jesd_30_code | R-PBGA-B84 |
jesd_609_code | e1 |
存储密度 | 2.68E8 bit |
内存IC类型 | DDR DRAM |
moisture_sensitivity_level | NOT SPECIFIED |
端口数 | 1 |
位数 | 1.68E7 words |
位数 | 16M |
操作模式 | SYNCHRONOUS |
组织 | 16MX16 |
输出特性 | 3-STATE |
包装材料 | PLASTIC/EPOXY |
ckage_code | TFBGA |
ckage_equivalence_code | BGA84,9X15,32 |
包装形状 | RECTANGULAR |
包装尺寸 | GRID ARRAY, THIN PROFILE, FINE PITCH |
eak_reflow_temperature__cel_ | 260 |
wer_supplies__v_ | 1.8 |
qualification_status | COMMERCIAL |
efresh_cycles | 8192 |
seated_height_max | 1.2 mm |
sequential_burst_length | 4,8 |
standby_current_max | 0.0050 Amp |
最大供电电压 | 0.3850 Amp |
表面贴装 | YES |
工艺 | CMOS |
温度等级 | INDUSTRIAL |
端子涂层 | TIN SILVER COPPER |
端子形式 | BALL |
端子间距 | 0.8000 mm |
端子位置 | BOTTOM |
ime_peak_reflow_temperature_max__s_ | 40 |
length | 12.5 mm |
width | 8 mm |
dditional_feature | AUTO/SELF REFRESH |
IS43DR16160A | 46DR83200A | IS46DR83200A | |
---|---|---|---|
描述 | 16M X 16 DDR DRAM, 0.4 ns, PBGA84 | 16M X 16 DDR DRAM, 0.4 ns, PBGA84 | 16M X 16 DDR DRAM, 0.4 ns, PBGA84 |
最大时钟频率 | 400 MHz | 400 MHz | 400 MHz |
功能数量 | 1 | 1 | 1 |
端子数量 | 84 | 84 | 84 |
最小工作温度 | -40 Cel | -40 Cel | -40 Cel |
最大工作温度 | 85 Cel | 85 Cel | 85 Cel |
额定供电电压 | 1.8 V | 1.8 V | 1.8 V |
最小供电/工作电压 | 1.7 V | 1.7 V | 1.7 V |
最大供电/工作电压 | 1.9 V | 1.9 V | 1.9 V |
加工封装描述 | 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 | 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 | 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 |
each_compli | Yes | Yes | Yes |
欧盟RoHS规范 | Yes | Yes | Yes |
状态 | EOL | EOL | EOL |
sub_category | DRAMs | DRAMs | DRAMs |
存取方式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
ccess_time_max | 0.4000 ns | 0.4000 ns | 0.4000 ns |
interleaved_burst_length | 4,8 | 4,8 | 4,8 |
i_o_type | COMMON | COMMON | COMMON |
jesd_30_code | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 |
jesd_609_code | e1 | e1 | e1 |
存储密度 | 2.68E8 bit | 2.68E8 bit | 2.68E8 bit |
内存IC类型 | DDR DRAM | DDR DRAM | DDR DRAM |
moisture_sensitivity_level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
端口数 | 1 | 1 | 1 |
操作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
组织 | 16MX16 | 16MX16 | 16MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
ckage_code | TFBGA | TFBGA | TFBGA |
ckage_equivalence_code | BGA84,9X15,32 | BGA84,9X15,32 | BGA84,9X15,32 |
包装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
包装尺寸 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
eak_reflow_temperature__cel_ | 260 | 260 | 260 |
wer_supplies__v_ | 1.8 | 1.8 | 1.8 |
qualification_status | COMMERCIAL | COMMERCIAL | COMMERCIAL |
efresh_cycles | 8192 | 8192 | 8192 |
seated_height_max | 1.2 mm | 1.2 mm | 1.2 mm |
sequential_burst_length | 4,8 | 4,8 | 4,8 |
standby_current_max | 0.0050 Amp | 0.0050 Amp | 0.0050 Amp |
最大供电电压 | 0.3850 Amp | 0.3850 Amp | 0.3850 Amp |
表面贴装 | YES | YES | YES |
工艺 | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子涂层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
端子形式 | BALL | BALL | BALL |
端子间距 | 0.8000 mm | 0.8000 mm | 0.8000 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM |
ime_peak_reflow_temperature_max__s_ | 40 | 40 | 40 |
length | 12.5 mm | 12.5 mm | 12.5 mm |
width | 8 mm | 8 mm | 8 mm |
dditional_feature | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
位数 | 16M | 16M | 16M |
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