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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> XC7K420T-2LFFG1156I

XC7K420T-2LFFG1156I: 产品描述Field Programmable Gate Array,; 产品类别可编程逻辑器件可编程逻辑; 文件大小2MB，共60页; 制造商XILINX(赛灵思); 官网地址https://www.xilinx.com/; 标准

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XC7K420T-2LFFG1156I概述

Field Programmable Gate Array,

XC7K420T-2LFFG1156I规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	XILINX(赛灵思)
Reach Compliance Code	compli
JESD-609代码	e1
湿度敏感等级	4
峰值回流温度（摄氏度）	245
可编程逻辑类型	FIELD PROGRAMMABLE GATE ARRAY
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
处于峰值回流温度下的最长时间	30

XC7K420T-2LFFG1156I相似产品对比

	XC7K420T-2LFFG1156I	XC7K70T-3FBG676I	XC7K70T-3FBG484I	XC7K70T-2LFBG676I	XC7K160T-3FBG484I	XC7K160T-3FBG676I	XC7K160T-3FFG676I	XC7K480T-3FFG1156I	XC7K480T-3FFG901I	XC7K420T-2LFFG901I
描述	Field Programmable Gate Array,	Field Programmable Gate Array, PBGA676, LEAD FREE, FBGA-676	Field Programmable Gate Array, PBGA484, LEAD FREE, FBGA-484	Field Programmable Gate Array,	Field Programmable Gate Array, PBGA484, LEAD FREE, FBGA-484	Field Programmable Gate Array, PBGA676, LEAD FREE, FBGA-676	Field Programmable Gate Array, PBGA676, LEAD FREE, FBGA-676	Field Programmable Gate Array, PBGA1156, LEAD FREE, FBGA-1156	Field Programmable Gate Array, PBGA900, LEAD FREE, FBGA-900	Field Programmable Gate Array,
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)
Reach Compliance Code	compli	compliant	not_compliant	compliant	not_compliant	compliant	compliant	compliant	compliant	compli
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1	e1	e1
湿度敏感等级	4	4	4	4	4	4	4	4	4	4
峰值回流温度（摄氏度）	245	245	250	245	250	245	245	245	245	245
可编程逻辑类型	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	TIN SILVER COPPER
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30	30
零件包装代码	-	BGA	BGA	-	BGA	BGA	BGA	BGA	BGA	-
针数	-	676	484	-	484	676	676	1156	900	-
端子数量	-	676	484	-	484	676	676	1156	900	-
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装形式	-	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	-
认证状态	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
表面贴装	-	YES	YES	-	YES	YES	YES	YES	YES	-
端子形式	-	BALL	BALL	-	BALL	BALL	BALL	BALL	BALL	-
端子位置	-	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-
Base Number Matches	-	1	1	1	1	1	1	-	-	-

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